Flexible Circuit Board Pressure Layout for Stable Terminal Bonding
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Solution Overview
Problem
The misalignment of second wirings and double-row of first binding terminals during the binding of a flexible circuit board and a printed circuit board assembly leads to inclination of side pressure, causing abnormal bonding impedance and reliability issues.
Innovation Solution
A flexible circuit board design with pressure transmission parts having an elastic modulus greater than or equal to the second wirings, disposed to transmit pressure to the binding terminals, ensuring proper alignment and avoiding inclination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the flexible circuit board uses a double-row design of binding terminals to accommodate a large number of pins, then the binding capacity is improved, but misalignment occurs between the second wirings and the double-row of first binding terminals, causing inclination of side pressure during binding
Solution Approach 1:
The patent introduces a wiring bridge as an intermediary element that mediates the connection between the first wirings and the second wirings. This wiring bridge is specifically designed to align with the double-row binding terminals, ensuring that the pressure during binding is evenly distributed and preventing misalignment issues while maintaining the high pin-count capability of the double-row design
2Reliability
If the second wirings are positioned to connect to the double-row binding terminals, then the electrical connection is established, but misalignment causes inclination of side pressure leading to abnormal bonding impedance
Solution Approach 1:
The patent implements preliminary alignment design in the layout of the wiring bridge and binding terminals. The wiring bridge is pre-positioned and dimensioned to precisely match the double-row binding terminal arrangement, ensuring that during the binding process, the pressure is automatically and evenly distributed across all binding terminals without requiring additional alignment adjustments, thus preventing inclination of side pressure and ensuring reliable bonding
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design prevents inclination of side pressure during binding, ensuring stable electrical connections and improved reliability by applying positive pressure through the substrate layer.
Implementation Method 1
a plurality of pressure transmission parts disposed on the second surface, where each of the pressure transmission parts includes at least a portion corresponding to at least a portion of respective one of the first binding terminals to enable the pressure transmission part to transmit pressure to the first binding terminals through the substrate layer
Implementation Method 2
an elastic modulus of each of the pressure transmission parts is greater than or equal to an elastic modulus of respective one of the second wirings
Data Source
AI summary
The present application provides a flexible circuit board, a display module, and an electronic device. The flexible circuit board includes first binding terminals disposed on a first surface of a substrate layer and pressure transmission parts disposed on a second surface of the substrate layer, where each of the pressure transmission parts includes at least a portion corresponding to at least a portion of respective one of the first binding terminals so that the pressure transmission part can transmit a pressure to the first binding terminal through the substrate layer, thereby alleviating a problem that the inclination of the side pressure is generated when the flexible circuit board and the printed circuit board assembly are bound.