Flexible Circuit Board Protrusion Interconnect
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Solution Overview
Problem
Existing methods for interconnecting flexible electronic components, such as smart cards, often fail due to rigidity issues with solder, welds, or adhesives, leading to connection degradation when bent, and require additional labor and materials, increasing costs.
Innovation Solution
The use of opposing sets of protrusions to hold electronic components together, forming an electrical connection without the need for clamping, soldering, welding, or adhesives, allowing the components to adopt a non-planar geometry and maintain contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If soldering or welding is used to interconnect electrical contacts, then electrical connection is established, but the rigid solder or weld breaks when the flexible structure is bent
Solution Approach 1:
The patent uses flexible printed circuit boards with flexible electrical contacts instead of rigid solder joints or welds. The flexible contacts can bend with the substrate without breaking, resolving the contradiction between maintaining reliable electrical connection and accommodating flexibility.
Solution Approach 2:
The patent changes the mechanical properties of the electrical contacts by using flexible printed circuit board materials with appropriate flexibility parameters. This allows the contacts to match the bending characteristics of the flexible substrate while maintaining electrical conductivity.
2Reliability
If conductive studs are inserted through holes and soldered or welded, then electrical interconnection is made, but the rigid studs break away from electrical contacts when bent
Solution Approach 1:
The patent eliminates rigid conductive studs and uses flexible electrical contacts integrated into the flexible printed circuit board. This flexible contact system bends with the substrate without breaking away from electrical contacts.
Solution Approach 2:
The patent merges the electrical contact function with the flexible substrate by integrating contacts directly into the flexible printed circuit board structure, eliminating the need for separate rigid studs that would break during bending.
3Reliability
If soldering or welding is used, then electrical connection is established, but additional labor and materials are required, increasing cost
Solution Approach 1:
The patent uses flexible printed circuit board technology where electrical contacts are printed or formed directly on the flexible substrate, eliminating the need for separate soldering or welding operations and reducing manufacturing complexity.
Solution Approach 2:
The flexible electrical contacts are self-aligning and self-connecting through the flexible circuit board structure, eliminating the need for additional labor-intensive soldering or welding operations.
Data Source
AI summary
The invention is directed to a method and apparatus for electrically interconnecting multiple electronic components together by disposing the electronic components between two opposing plurality of protrusions that hold the electrical components together and establish an electrical connection therebetween. Each plurality of protrusions may be disposed in an offset arrangement with the opposing protrusions. The opposing protrusions cause the electronic components to bend and adopt a deflected geometry when they are positioned between the opposing sets of protrusions. This bending results in the electronic components being biased against each other so that electrical contacts on each electronic component may be held together and thereby form an electrical connection. As a result, the opposing sets of protrusions can be used to electrically interconnect a plurality of electrical components in the absence of clamping, adhesion, soldering, or pinching.