Flexible Circuit Board Assembly with Reinforcing Plate
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Solution Overview
Problem
The existing circuit board assemblies face challenges in achieving smooth attachment of a reinforcing plate to a flexible printed circuit board due to the multi-layer structure of the flexible circuit board, resulting in spacing issues between the two components.
Innovation Solution
A circuit board assembly design featuring a flexible circuit board with a copper plating layer, a dielectric layer, and a reinforcing plate mounted using a conductive adhesive, where the dielectric layer has a bonding portion and a grounding portion, and the reinforcing plate has a corresponding cavity and extending portion covered by the conductive adhesive for secure electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a reinforcing plate is mounted directly to a multi-layer flexible circuit board using conductive adhesive, then grounding and stiffening functions are achieved, but the multi-layer structure prevents smooth attachment causing spacing between the reinforcing plate and flexible circuit board
Solution Approach 1:
A dielectric layer is introduced as an intermediary component between the reinforcing plate and the flexible circuit board. This dielectric layer includes a bonding portion that contacts the reinforcing plate and a grounding portion that contacts the flexible circuit board, enabling the reinforcing plate to be smoothly attached while maintaining both grounding and stiffening functions.
Solution Approach 2:
The dielectric layer is segmented into distinct functional portions: a bonding portion for mechanical attachment to the reinforcing plate and a grounding portion for electrical connection to the flexible circuit board. This segmentation allows each portion to optimize its specific function while working together as a unified interface.
2Strength
If a reinforcing plate is mounted directly to a multi-layer flexible circuit board, then stiffening function is achieved, but spacing occurs between the reinforcing plate and flexible circuit board due to multi-layer structure
Solution Approach 1:
The dielectric layer serves as a mediator that enables smooth attachment of the reinforcing plate to the flexible circuit board. The bonding portion of the dielectric layer provides a flat mounting surface for the reinforcing plate, eliminating spacing issues while the grounding portion maintains electrical connection, thus preserving the stiffening function.
Solution Approach 2:
The dielectric layer adds an intermediate dimension between the reinforcing plate and the flexible circuit board layers. This additional layer resolves the spacing problem by providing a dedicated bonding interface that bridges the multi-layer structure, allowing the reinforcing plate to make uniform contact.
3Reliability
If conductive adhesive is used to mount the reinforcing plate, then grounding function is achieved, but the multi-layer structure of the flexible circuit board prevents proper bonding
Solution Approach 1:
The dielectric layer acts as an intermediary that facilitates the bonding process. The bonding portion provides a suitable surface for conductive adhesive application and bonding to the reinforcing plate, while the grounding portion maintains electrical connection to the flexible circuit board, thus simplifying the overall bonding process despite the multi-layer structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures a secure and electrically connected attachment of the reinforcing plate to the flexible circuit board, addressing the spacing issues and enhancing the grounding and stiffening functions of the assembly.
Implementation Method 1
The reinforcing plate is mounted on the bonding portion of the dielectric layer by means of the conductive adhesive 40
Data Source
AI summary
A circuit board assembly includes a flexible circuit board, a dielectric layer and a reinforcing plate. The flexible circuit board includes a surface. A copper plating layer is positioned on the surface. The copper plating layer includes a circuit portion and a grounding portion. The circuit portion is entirely covered by the dielectric layer. The grounding portion is exposed outside the dielectric layer. The dielectric layer includes a bonding portion. The reinforcing plate includes a connection surface. The connection surface defines a cavity spatially corresponding to the bonding portion. The connection surface also includes an extending portion which is bulgy with respect to a bottom surface of the cavity. The extending portion spatially corresponds to the grounding portion. The bonding portion is received in the cavity with the extending portion in contact with and electrically connecting to the grounding portion by means of a conductive adhesive.