Flexible Circuit Board Assembly with Reinforcing Plate Projections
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Solution Overview
Problem
The existing circuit board assemblies face challenges in achieving smooth attachment and electrical connectivity between the flexible printed circuit board and the reinforcing plate due to the multi-layer structure of the flexible circuit board, resulting in spacing issues and ineffective grounding.
Innovation Solution
A circuit board assembly design incorporating a dielectric layer, a reinforcing plate with perpendicularly extending projections, and an Anisotropic Conductive Film (ACF) conductive adhesive, where the projections contact the grounding portion of the conductive layer, ensuring even loading and electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a flexible printed circuit board with multi-layer structure is bonded to a reinforcing plate using conductive adhesive, then grounding function is achieved, but the reinforcing plate cannot be smoothly attached and spacing occurs between the reinforcing plate and flexible circuit board
Solution Approach 1:
The invention divides the contact interface into multiple segments by adding protrusions to the reinforcing plate. These protrusions make contact with corresponding recesses or conductive patterns on the flexible circuit board at discrete points, allowing the multi-layer flexible board to be bonded without requiring complete surface contact, thus eliminating spacing issues while maintaining grounding reliability.
Solution Approach 2:
The conductive adhesive serves as an intermediary material that fills the gaps between the protrusions of the reinforcing plate and the flexible circuit board. This intermediary enables both mechanical bonding and electrical connectivity, resolving the contradiction between achieving smooth attachment and maintaining the flexibility of the multi-layer structure.
2Reliability
If conductive adhesive is used to bond the flexible circuit board and reinforcing plate, then electrical connectivity is achieved, but spacing between components occurs due to multi-layer structure
Solution Approach 1:
The protrusions on the reinforcing plate are pre-positioned to align with corresponding contact points on the flexible circuit board before bonding. This preliminary positioning ensures that when the conductive adhesive is applied, immediate and reliable electrical contact is established at the protrusion tips, minimizing spacing while ensuring connectivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables secure and even attachment of the reinforcing plate to the flexible circuit board, promoting effective grounding and electrical connectivity while maintaining the structural integrity of the assembly.
Implementation Method 1
an Anisotropic Conductive Film (ACF) conductive adhesive, where the projections contact the grounding portion of the conductive layer
Implementation Method 2
The dielectric layer 20 is made of resin and is substantially rectangular in shape. The dielectric layer 20 partially covers the conductive layer 13.
Data Source
AI summary
A circuit board assembly includes a flexible circuit board and a reinforcing plate. The flexible circuit board includes a surface. A conductive layer is positioned on the surface. The conductive layer includes a circuit portion entirely covered by a dielectric layer and a grounding portion exposed outside the dielectric layer. The reinforcing plate is mounted on the dielectric layer. The reinforcing plate includes a connection surface connected to the dielectric layer and a supporting surface facing away from the connection surface. Projections extend from the connection surface. The location of all of the projections correspond to the location of the grounding portion, and all of the projections are in electrical contact with the grounding portion by means of a conductive adhesive.