Flexible Circuit Package With Segmented Conductive Voids
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Solution Overview
Problem
Flexible circuit packages face issues with maintaining reliable electrical integrity and flexibility due to conductive material breakage during bending, leading to signal loss and circuit failure in pressure measurement applications.
Innovation Solution
A flexible circuit package design featuring a conductive material deposited on a base substrate with interconnected patterns and void spaces, acting as rip-stops to prevent crack propagation, and redundant pathways for maintaining electrical communication, along with reinforcement elements to mitigate deformation and enhance durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional conductive materials are used in flexible circuits, then electrical conductivity is improved, but flexibility and resistance to breakage deteriorate
Solution Approach 1:
The conductive material is patterned with interconnected void spaces that segment the conductive paths into multiple smaller segments. This segmentation allows the conductive material to flex and deform without creating continuous cracks, as the void spaces act as stress relief points that prevent crack propagation across the entire conductive trace.
Solution Approach 2:
The patent uses a composite structure combining conductive material with void spaces within a single layer. This composite design integrates both the electrical conductivity function and the mechanical flexibility function into one element, allowing the conductive material to maintain electrical integrity while accommodating flexion and deformation.
2Reliability
If conductive material is made continuous for reliable electrical communication, then electrical conductivity is improved, but resistance to cracking during flexion deteriorates
Solution Approach 1:
The conductive material has non-uniform local properties due to the patterned void spaces. In regions where void spaces are located, the material is intentionally discontinuous to prevent crack propagation. In regions between void spaces, the material maintains continuity for electrical conduction. This local variation in quality allows the same material to simultaneously provide both electrical connectivity and crack resistance.
3Reliability
If reinforcement sheets are added to prevent trace breakage, then durability is improved, but flexibility deteriorates
Solution Approach 1:
The patent uses a thin-film conductive material with patterned void spaces instead of adding thick reinforcement sheets. This thin-film approach maintains the flexibility of the base sheet while providing sufficient durability through the crack-arresting void space pattern, avoiding the flexibility penalty associated with thick reinforcement layers.
Data Source
AI summary
A flexible circuit package. The circuit package includes a termination point on a flexible base substrate. The termination point is connected with an interface by conductive material on the base substrate. The conductive material extends across the surface area of the base substrate in multiple individual connections, which are in communication with each other and separated by voids in the conductive material for mitigating communication failure between the termination point and the interface during or following flexion, stretching, compression or other deformation of the base substrate and the circuit package. The termination point may include an input module such as a sensor, switch or other input. The termination point may include an output module such as a light, vibrator or other output. The interface may include an output interface for receiving data or an input interface for sending a command or other signal.