Flexible Circuit Package Storage Device Warpage Reduction

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Conventional flexible circuit packages experience warpage due to their flexible substrate material, making it difficult to bond them to electronic components effectively.

Innovation Solution

A storage device comprising a first and second carrier with specific accommodation elements and press portions that accommodate and press the warped circuit portions of flexible circuit packages to minimize warpage, ensuring they are flatter and easier to bond.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If flexible substrate material (polyimide) is used for flexible circuit packages, then flexibility and adaptability are improved, but warpage occurs after substrate dicing making bonding difficult

Engineering Contradiction:

ImproveflexibilityVSAvoidflatness

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The storage device applies pressing force to the flexible circuit package before the bonding process. The pressing portions press the circuit portions against the accommodation grooves in advance, pre-flattening the warped circuit portions to ensure proper bonding conditions are met before bonding occurs

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The storage device changes the physical state of the flexible circuit package by applying mechanical pressing force. This transforms the warped circuit portions from a curved state to a flattened state, changing the geometric parameters (flatness, contact area) to suitable values for bonding

Inventive Principle:

Principle #35Parameter changes

2Stability of the object's composition

If the circuit portion is warped after substrate dicing, then the flexible material properties are maintained, but bonding to electronic components becomes difficult

Engineering Contradiction:

Improvematerial propertiesVSAvoidbonding ease

Core Design Contradiction:

Stability of the object's compositionVSEase of manufacture

Solution Approach 1:

The storage device performs preliminary flattening action by pressing the warped circuit portions against the accommodation grooves before the bonding process, ensuring that the material properties are preserved while the geometric shape is corrected to facilitate bonding

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The accommodation grooves and pressing portions act as intermediary elements between the warped circuit portion and the bonding process. The grooves provide a flat reference surface while the pressing portions apply controlled force, mediating the transition from warped to flattened state for successful bonding

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS11792923B2Storage device for flexible circuit packages and carrier thereof

Publication Date: 2023.10.17 CHIPBOND TECH

AI summary

A storage device of the present invention is provided to store flexible circuit packages, each of the flexible circuit packages includes an electronic component and two circuit portions warped at both sides of the electronic component, respectively. The storage device includes a first carrier and a second carrier. The first carrier includes first accommodation elements provided for placement of the flexible circuit packages, and the second carrier includes a first press portion and a second press portion. As the second carrier is placed on the first carrier, the first and second press portions are provided to press the two circuit portions warped upwardly toward the second carrier so as to reduce the warpage of the two circuit portions.