Flexible Circuit Substrate Shock Absorption in Electronic Devices
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Solution Overview
Problem
Electronic devices face reliability issues due to external impacts causing abnormal movement of internal components, which existing technologies fail to adequately address.
Innovation Solution
The electronic device incorporates a display module with a non-bending and bending region, a first and second circuit substrate, and adhesion members to securely fasten components, including a conductive member and adhesion members to stabilize the driving chip and prevent abnormal movement from external impacts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electronic components are assembled with combining members in a case, then the device can be manufactured with standard assembly processes, but external impacts can cause abnormal movement of components reducing reliability
Solution Approach 1:
The patent applies beforehand cushioning by providing a shock-absorbing structure between the circuit substrate and case. The bending region of the circuit substrate acts as a compliant element that deforms under external impact to absorb shock energy, preventing direct transmission of impact forces to the electronic components. This pre-configured cushioning mechanism protects components from abnormal movement during impact events.
Solution Approach 2:
The patent utilizes the flexible properties of the circuit substrate, particularly the bending region with reduced thickness, to create a flexible mounting structure. The circuit substrate can elastically deform in response to external impacts, absorbing shock while maintaining electrical connections. This flexible approach replaces rigid fixing methods that would transmit impact forces directly to components.
2Shape
If the display panel is bent to fit the device form factor, then the device achieves a compact design, but the bending region becomes vulnerable to external impacts
Solution Approach 1:
The patent applies local quality by creating a bending region with specific local properties - reduced thickness and increased flexibility - only where curvature is needed, while maintaining full thickness and rigidity in the non-bending regions. This localized modification allows the display module to achieve the required curved shape while concentrating flexibility only in the necessary area, improving overall structural reliability.
Solution Approach 2:
The patent segments the circuit substrate into distinct bending and non-bending regions with different structural properties. The bending region is designed as a separate functional zone with modified thickness to handle curvature requirements, while the non-bending regions maintain full structural integrity. This segmentation allows the curved display to achieve its shape while protecting vulnerable areas through strategic structural differentiation.
3Reliability
If adhesion members are used to fix circuit substrates, then component stability is improved, but the fabrication process becomes more complex
Solution Approach 1:
The patent merges the adhesion function with the structural support function by integrating the adhesion member into the existing circuit substrate assembly. The adhesion member is combined with the bending region structure, creating a unified component that provides both mechanical support and stable fixation. This merging reduces the number of separate parts and simplifies the overall assembly structure while maintaining component stability.
Data Source
AI summary
An electronic device may include a window member and a display module disposed on a rear surface of the window member. The display module may include a display panel with a non-bending region and a bending region, a first circuit substrate disposed on a rear surface of the display panel, a second circuit substrate electrically connecting the display panel to the first circuit substrate, a first adhesion member disposed on a rear surface of the first circuit substrate to combine the first circuit substrate with a first member different from the first circuit substrate, and a second adhesion member disposed on a rear surface of the second circuit substrate to combine the second circuit substrate with a second member different from the first circuit substrate.