Flexible Circuit Board Supporting Element for Display Thermal Management

The supporting element serves multiple functions: it maintains contact between the flexible printed circuit board and the chassis for heat dissipation, provides structural support to prevent board deformation, and ensures proper positioning of the semiconductor device. By combining these functions into a single component, the patent improves heat dissipation efficiency without proportionally increasing device complexity.

The supporting element is made from elastic material with specific physical parameters (elastic modulus, hardness) that allow it to maintain constant contact with the chassis under varying operating conditions. By carefully selecting and controlling these material parameters, the patent achieves stable heat dissipation while managing manufacturing precision requirements through standardized material specifications.

The air paths are nested within the structure of the supporting element itself, forming an integrated cooling system. The supporting element contains internal channels or cavities that allow air flow directly through it, enabling heat dissipation without requiring separate cooling components. This nesting approach improves heat dissipation efficiency while minimizing the increase in device complexity.