Flexible Circuit Binding Terminal Insulating Protrusion Design
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Solution Overview
Problem
In flexible OLED display manufacturing, the Anisotropic Conductive Film (ACF) adhesive often causes glue overflow, which fails to adequately cover smaller binding terminals, increasing the risk of corrosion and affecting the yield rate due to varying pin sizes and signal types.
Innovation Solution
The display module design includes a flexible circuit board with binding terminals of different volumes, where smaller terminals are enhanced with insulating protrusions to increase coverage by the conductive adhesive, ensuring better protection and yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ACF adhesive is applied to pins and pressed with flexible circuit board, then binding terminals are connected and larger terminals are covered, but smaller binding terminals are not adequately covered increasing corrosion risk
Solution Approach 1:
The insulating layer is designed with different thicknesses in different regions: a first thickness in the first sub-area corresponding to larger binding terminals, and a second thickness greater than the first thickness in the second sub-area corresponding to smaller binding terminals. This local variation ensures adequate adhesive coverage and corrosion protection for all terminal sizes.
Solution Approach 2:
The insulating layer is prepared in advance with varying thicknesses before the ACF adhesive application process. This preliminary structuring of the insulating layer ensures that smaller binding terminals will be adequately protected during subsequent adhesive application, eliminating the need for post-processing adjustments.
2Ease of manufacture
If uniform insulating layer thickness is used across all binding terminals, then manufacturing is simplified, but smaller terminals receive insufficient adhesive coverage
Solution Approach 1:
The insulating layer incorporates a thickness gradient with a first thickness in the first sub-area and a second thickness in the second sub-area, where the second thickness is greater than the first thickness. This local differentiation achieves precise adhesive coverage control while maintaining a relatively simple manufacturing process.
3Reliability
If ACF adhesive amount is increased to cover all terminals, then smaller terminals are protected, but glue overflow increases and manufacturing complexity increases
Solution Approach 1:
The insulating layer is structured with spatially varying thickness to create local adhesive reservoirs over smaller binding terminals. This allows the use of a uniform adhesive application process while achieving differential protection levels, avoiding the need for complex adaptive adhesive dispensing systems.
Solution Approach 2:
The insulating layer thickness variation is established beforehand to pre-position adhesive retention zones. This preliminary action simplifies the adhesive application process by eliminating the need for real-time adjustment of adhesive amount based on terminal size.
Data Source
AI summary
The application discloses a display module and a display device, comprising a flexible circuit board; the flexible circuit board includes a plurality of binding terminals and insulating parts; each of binding terminals includes a first sub-part and a second sub-part connected to each other, the flexible circuit board includes a first binding terminal and a second binding terminal, and the volume of the first sub-pare of the first binding terminal is larger than the volume of the first sub-part of the second binding terminal; and the insulating part includes a first insulating protrusion corresponding to the second binding terminal.