Flexible Conductive Layer Circuit for Intravascular Trace Reliability
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Solution Overview
Problem
Conductive traces in intravascular medical devices are prone to breaking, making the devices unusable and costly to repair or replace.
Innovation Solution
The medical devices incorporate a flexible circuit with at least two conductive layers and a tensioning member to maintain a flattened configuration of flexible electronics, preventing deformation and ensuring reliable electrical conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single conductive layer is used in the flexible circuit, then the device structure is simpler, but the conductive traces break easily and reliability deteriorates
Solution Approach 1:
The patent transitions from a single-layer conductive structure to a multi-layer conductive structure, adding the vertical dimension (z-axis) to the circuit design. Multiple conductive layers are stacked and interconnected via vias, creating three-dimensional trace routes that provide redundancy and alternative current paths, thereby improving reliability without excessive complexity increase.
Solution Approach 2:
The patent employs composite construction by combining multiple conductive layers with insulating materials and interconnect structures (vias). This composite approach creates a robust multi-layer flexible circuit where each layer and interconnect component contributes to overall trace reliability, preventing single-point failures that would occur in single-layer designs.
2Adaptability or versatility
If the flexible circuit is allowed to deform freely, then the device is more flexible and adaptable, but the conductive traces break due to deformation
Solution Approach 1:
By distributing conductive paths across multiple layers stacked in the vertical dimension, the patent creates redundant trace routes that can accommodate flexible circuit deformation. When the circuit bends or flexes, the three-dimensional trace architecture provides alternative current paths that maintain electrical connectivity even when individual traces experience stress.
Solution Approach 2:
The multi-layer structure with interconnected vias acts as a preemptive protective mechanism against trace breakage. Before deformation occurs, the redundant vertical and lateral connectivity paths are established, cushioning against the harmful effects of future bending or flexing by providing pre-configured alternative routes for electrical current.
3Reliability
If multiple conductive layers are added to create redundant trace routes, then reliability improves, but device complexity increases
Solution Approach 1:
The patent efficiently achieves redundancy by utilizing the vertical dimension through stacked conductive layers connected by vias. This three-dimensional approach provides multiple trace routes without proportionally increasing lateral space requirements, allowing reliable multi-path conductivity within the constraints of flexible circuit geometry.
Solution Approach 2:
The multi-layer flexible circuit structure embeds multiple conductive layers within each other, with each layer nested in the vertical stack and interconnected through vias. This nesting arrangement provides redundant trace routes in a compact configuration, achieving high reliability while minimizing the overall footprint and managing structural complexity through hierarchical organization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution minimizes deformation and maintains electrical conductivity, reducing the risk of trace breakage and extending the device's lifespan and usability.
Implementation Method 1
a second conductive layer may be disposed on a second surface opposite the first surface such that electrical energy may be capable of being conducted through the flexible circuit to the first conductive layer and the second conductive layer
Data Source
AI summary
Disclosed herein are medical devices configured and sized to be positioned within a subject. Medical devices may comprise a flexible circuit comprising at least two conductive layers. A first conductive layer may be disposed on a first surface of the flexible circuit and a second conductive layer is disposed on a second surface opposite the first surface such that electrical energy is capable of being conducted through the flexible circuit to the first conductive layer and the second conductive layer. Medical devices may comprise an electro acoustic module (EAM) disposed at or adjacent a distal region of the flexible circuit, the EAM coupled to the flexible circuit to define a distal tip of the medical device. The at least two conductive layers create trace routes via the flexible circuit to the EAM.