Dual PCB Transceiver Module Using Flexible Circuit Interconnects

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Solution Overview

Problem

Transceiver modules face challenges in reliably and cost-effectively passing electrical data signals between transmitters and receivers due to space constraints and offset PCB planes.

Innovation Solution

Incorporating flexible circuits with conductive traces that allow electrical data signals to be transmitted between transmitters and receivers, even when the PCB planes are offset, enabling effective communication across non-parallel planes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional rigid PCB connections are used, then structural stability is maintained, but space constraints and offset PCB planes make signal transmission difficult

Engineering Contradiction:

Improvesignal transmission reliabilityVSAvoidPCB plane alignment complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent employs flexible PCBs that can dynamically bend and flex to accommodate offset planes between transmitter and receiver components. This dynamic flexibility allows the PCB to adapt to spatial constraints while maintaining reliable electrical connections, resolving the contradiction between connection reliability and alignment complexity.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The invention uses flexible circuit boards with conductive traces that can bend and conform to non-planar arrangements. These flexible thin film structures enable signal transmission across offset PCB planes without requiring complex rigid alignment mechanisms, thereby improving signal reliability while reducing structural complexity.

Inventive Principle:

Principle #30Flexible shells and thin films

2Reliability

If flexible circuits are used to accommodate offset planes, then signal transmission is enabled, but manufacturing precision requirements increase

Engineering Contradiction:

Improvedata signal transmissionVSAvoidconductive trace alignment

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The flexible PCB is segmented into multiple layers with conductive traces distributed across different planes. This segmentation allows each layer to be manufactured with standard precision tolerances, while the cumulative effect of multiple layers achieves the required three-dimensional connectivity without demanding excessive precision from any single manufacturing step.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent transitions from two-dimensional PCB routing to three-dimensional multi-layer flexible circuit routing. By utilizing the vertical dimension and multiple PCB layers, the design achieves complex spatial connections without requiring ultra-precise lateral alignment, effectively distributing manufacturing tolerance requirements across multiple dimensions.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Adaptability or versatility

If dual PCBs are used to separate transmitter and receiver circuits, then functional integration is improved, but space constraints make connections difficult

Engineering Contradiction:

Improvetransmitter and receiver integrationVSAvoidtransceiver module area

Core Design Contradiction:

Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The patent merges the transmitter PCB and receiver PCB into a compact dual-PCB assembly where both circuits are integrated within a small form factor. The flexible circuits enable these separate functional modules to be closely coupled, achieving high functional integration while maintaining compact overall dimensions that satisfy space constraints.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The design employs a nested arrangement where the transmitter and receiver PCBs are positioned in offset planes within the same module housing. The flexible conductive traces nest between these PCBs, allowing multiple functional layers to be stacked vertically rather than spread horizontally, thereby reducing the overall module area while maintaining separate transmitter and receiver circuits.

Inventive Principle:

Principle #7Nested doll (Nesting)

Data Source

PatentUS8057109B2Transceiver module with dual printed circuit boards

Publication Date: 2011.11.15 II VI DELAWARE INC

AI summary

Transceiver modules with dual printed circuit boards. In one example embodiment, a transceiver module includes first and second printed circuit boards (PCBs), a transmitter, a receiver, and a flexible circuit. The first PCB is positioned in a first plane and the second PCB is positioned in a second plane. The transmitter and the receiver are both positioned in a third plane that is offset from the first and second planes. The flexible circuit includes conductive traces that allow electrical data signals to pass between the transmitter and the receiver and the first and second PCBs.