Flexible Circuitry Layers for Durable Washable Soft Goods

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Solution Overview

Problem

Traditional methods for manufacturing electronic circuitry are insufficiently flexible and lack durability, adaptability, and ease of integration into soft goods such as textiles and upholstered products, making them unsuitable for a wide range of applications.

Innovation Solution

The development of flexible circuitry layers comprising a conductive mesh with a circuitry trace, an interfacing component with a flexible substrate, and a connector for detachable connection to external devices, along with an integrated circuit for control and insulating layers for durability and washability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If traditional methods of manufacturing electronic circuitry are used, then circuitry can be produced with standard manufacturing processes, but the circuitry is insufficiently flexible to be incorporated into soft goods

Engineering Contradiction:

Improvemanufacturing process compatibilityVSAvoidflexibility

Core Design Contradiction:

Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The patent applies this principle by using a flexible substrate (such as flexible PCB or thin film) instead of traditional rigid circuit boards. The circuit traces are formed on this flexible substrate, allowing the entire circuit assembly to bend and conform to soft goods while maintaining electrical connectivity. This resolves the contradiction by providing both manufacturability through standard flexible PCB processes and the required flexibility for soft good integration.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The patent employs composite materials by combining flexible substrate materials with conductive trace materials and protective coating materials. The multi-layer composite structure includes the flexible base substrate, conductive pathways, insulating layers, and protective overcoats, creating a circuit board that is both manufacturable and sufficiently flexible for soft good applications.

Inventive Principle:

Principle #40Composite materials

2Ease of manufacture

If traditional electronic circuitry is used, then standard electronic components can be integrated, but the circuitry lacks durability and washability

Engineering Contradiction:

Improvecomponent integrationVSAvoiddurability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

A protective flexible coating layer is applied over the circuit traces and components. This coating acts as a barrier against moisture, dust, and mechanical damage, thereby improving durability and washability while allowing the circuit to remain integrated with soft goods. The coating is applied using conformal coating techniques that follow the circuit layout.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The patent uses composite material structures with multiple protective layers including waterproof coatings, adhesive layers, and reinforcement materials. These composite layers protect the electronic components and traces from environmental damage while maintaining flexibility and durability for washable applications.

Inventive Principle:

Principle #40Composite materials

3Reliability

If traditional rigid circuit boards are used, then stable electrical connections can be established, but the circuitry cannot be easily integrated into soft goods

Engineering Contradiction:

Improveelectrical connection stabilityVSAvoidintegration capability

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent replaces rigid circuit boards with flexible circuit boards that maintain stable electrical connections through carefully designed trace geometries, proper copper thickness, and reliable soldering techniques adapted for flexible substrates. The flexible nature allows easy integration into soft goods while the electrical connection stability is maintained through proper design and manufacturing controls.

Inventive Principle:

Principle #30Flexible shells and thin films

4Adaptability or versatility

If flexible circuitry is created, then the circuitry can be integrated into soft goods, but the circuitry lacks durability and washability

Engineering Contradiction:

ImproveflexibilityVSAvoiddurability

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

Multiple protective coating layers are applied over the flexible circuit traces and components. These coatings provide waterproofing, mechanical protection, and chemical resistance, enabling the flexible circuit to withstand washing and harsh environmental conditions while maintaining its flexibility and electrical functionality.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The patent employs a composite structure with the flexible substrate combined with multiple protective layers including adhesives, waterproof coatings, and reinforcement materials. This composite construction enhances durability and washability while preserving the flexibility needed for soft good integration.

Inventive Principle:

Principle #40Composite materials

Data Source

PatentUS11798891B2Electronic components for soft, flexible circuitry layers and methods therefor

Publication Date: 2023.10.24 LOOMIA TECHNOLOGIES INC

AI summary

A flexible circuitry layer may comprise a conductive mesh including a circuitry trace; and an interfacing component, comprising: a flexible substrate; a terminal electrically connected to the circuitry trace; and a connector configured to be detachably connected to an external device.