Flexible CMOS Neural Electrode Array for Wireless Brain Interfaces

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Solution Overview

Problem

Existing neural recording devices are cumbersome, prone to infection, and cause inflammatory responses due to their rigid nature and the need for external wires, limiting their effectiveness for long-term use and data transmission.

Innovation Solution

A fully implanted, wireless, flexible CMOS surface recording device with neural electrode arrays, incorporating a thinned CMOS integrated circuit and a flexible printed circuit board, featuring wireless power and data transmission, and a biocompatible encapsulation, to minimize tissue disruption and enhance chronic viability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional electrode arrays with external wires are used, then data transmission can be achieved, but the device becomes cumbersome and prone to infection

Engineering Contradiction:
Improveinfection riskVSAvoiddevice structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent removes external wires and connects the electrode array directly to the implantable CMOS device, extracting the harmful external connection component while maintaining data transmission functionality through integrated wireless communication

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent combines the electrode array, CMOS processing circuitry, and wireless communication functions into a single integrated implantable device, eliminating the need for external wire connections and reducing infection risk

Inventive Principle:
Principle #5Merging (Combining)

2Stability of the object's composition

If rigid electrodes are used, then structural stability is achieved, but inflammatory response and scarring increase

Engineering Contradiction:
Improvestructural stabilityVSAvoidinflammatory response
Core Design Contradiction:
Stability of the object's compositionVSObject-affected harmful factors

Solution Approach 1:

The patent employs flexible CMOS devices with thin-film structures that can conform to the curved surface of the brain, replacing rigid electrodes with flexible thin films that reduce mechanical mismatch and inflammatory response while maintaining structural integrity

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The patent changes the mechanical properties of the electrode substrate from rigid to flexible by using thin-film CMOS technology, altering the physical parameters to match the soft tissue environment and reduce glial scarring

Inventive Principle:
Principle #35Parameter changes

3Measurement precision

If high-density electrode arrays are implemented, then recording capability is improved, but device complexity and tissue displacement increase

Engineering Contradiction:
Improverecording capabilityVSAvoidtissue displacement
Core Design Contradiction:
Measurement precisionVSVolume of stationary object

Solution Approach 1:

The patent uses flexible thin-film CMOS devices that can be made extremely thin to reduce tissue displacement volume while maintaining high-density electrode arrangements for improved recording capability

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The patent arranges electrodes in high-density patterns across the flexible surface, utilizing two-dimensional spatial arrangement to achieve high channel counts without increasing the device's volumetric footprint

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides safe, long-term bi-directional neural communication with reduced inflammation and infection risk, enabling high-density neural recording and stimulation for various clinical applications.

Implementation Method 1

The CMOS integrated circuit can be thinned down such that it is mechanically flexible

Methodology Applied
Scientific EffectMechanical thinning:

Implementation Method 2

a flexible printed circuit board containing a plurality of electrodes coupled to the CMOS integrated circuit

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 3

a radio transceiver for data transmission

Methodology Applied
Scientific EffectElectromagnetic transmission: Electromagnetic Induction

Implementation Method 4

featuring wireless power and data transmission, and a biocompatible encapsulation, to minimize tissue disruption and enhance chronic viability

Methodology Applied
Scientific EffectBiocompatible barrier:

Data Source

PatentUS20250331755A1Implantable and flexible CMOS recording and stimulating device which includes one or more neural electrode arrays
Publication Date: 2025.10.30 THE TRUSTEES OF COLUMBIA UNIV IN THE CITY OF NEW YORK
  • US20250331755A1 patent drawing
  • US20250331755A1 patent drawing
  • US20250331755A1 patent drawing

AI summary

An exemplary system can be provide for facilitating electrophysiological recording and/or stimulation. The exemplary system can comprise a wireless neural interface device that can include a complementary metal-oxide-semiconductor (CMOS) integrated circuit. A flexible printed circuit board can also be provided with the system that can include a plurality of electrodes coupled to the CMOS integrated circuit. In addition, an exemplary method can be provided for manufacturing a wireless neural interface device for an electrical stimulation. According to such exemplary method, it is possible to provide a complementary metal-oxide-semiconductor (CMOS) integrated circuit that is mechanically flexible by being thinned. Further, it is possible to provide a flexible printed circuit board containing a plurality of electrodes. Then, it is possible to couple the flexible printed circuit board to the CMOS integrated circuit.