Flexible Substrate Coil Manufacturing for High Current Density
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Solution Overview
Problem
Existing coil manufacturing methods are complex, leading to low inductance and limited current density, which increases costs and restricts the ability to generate precise three-dimensional magnetic fields with varied configurations.
Innovation Solution
A method involving a flexible, electrically insulating substrate rolled or folded with applied conductors, using a lithographic process for precise positioning and an intermediate thermal layer for heat dissipation, allowing for high current density and diverse magnetic field generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional winding methods are used to produce coils, then coils can be manufactured with defined winding patterns, but the manufacturing process becomes very complex and time-consuming
Solution Approach 1:
The patent replaces traditional mechanical winding processes with a printing-based manufacturing method. Conductive patterns are directly printed onto flexible substrates to form coil structures, eliminating the need for complex mechanical winding equipment and manual winding operations while maintaining precise geometric control of the coil windings
Solution Approach 2:
The invention changes the manufacturing approach from mechanical winding to additive printing processes. By using printing technology, the coil structures are formed by depositing conductive material in predetermined patterns, fundamentally altering the manufacturing parameters from mechanical motion control to material deposition control
2Reliability
If conventional coil winding is used, then coils can be produced, but ohmic losses increase and current density is limited due to heat dissipation requirements
Solution Approach 1:
The patent employs flexible thin film substrates as the base for coil structures. These thin film structures provide excellent thermal conductivity and heat dissipation capabilities, allowing higher current densities to be sustained without excessive temperature rise, thereby reducing the impact of ohmic losses and enabling improved coil performance
Solution Approach 2:
The invention uses composite structures combining flexible substrates with conductive materials. The substrate material is specifically chosen for its thermal properties, creating a composite system that efficiently manages heat generated by ohmic losses, enabling higher current density operation while maintaining reliability
3Quantity of substance
If film or tape coils are wound in one layer to achieve high conductor fill factor, then conductor density increases, but inductance remains low
Solution Approach 1:
The patent transitions from single-layer planar coil structures to multi-layer three-dimensional coil configurations. By stacking multiple conductive layers on flexible substrates and connecting them through via holes, the invention achieves both high conductor fill factor within each layer and increased overall inductance through the three-dimensional winding patterns, effectively utilizing vertical space to enhance magnetic field generation
4Manufacturing precision
If multi-layer multipole coils are required for precise three-dimensional magnetic field generation, then field configuration precision improves, but manufacturing complexity increases significantly
Solution Approach 1:
The patent divides complex multi-layer multipole coil structures into modular segments on flexible substrates. Each substrate layer contains specific coil patterns that can be independently designed and manufactured, then assembled into the complete multi-layer structure. This segmentation approach enables precise control of magnetic field configurations while simplifying the overall manufacturing process through standardized modular units
Solution Approach 2:
The invention utilizes multi-layer three-dimensional arrangements of conductive patterns on flexible substrates to generate precise three-dimensional magnetic fields. By controlling the spatial arrangement, layer spacing, and winding patterns across multiple layers, the system achieves complex multipole field configurations that would be difficult to realize with conventional single-layer structures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the production of coils with high current density and precise magnetic field control, reducing complexity and cost while enabling a wide range of magnetic field configurations.
Implementation Method 1
an intermediate layer, in particular a thermal conductor, e.g. B. a thermally conductive adhesive, is arranged to absorb and dissipate thermal energy
Implementation Method 2
when an electric current is applied to the current conductors, a magnetic field with a precisely defined, predetermined field structure can be generated
Data Source
Figure 1~2
Figure 3A~3B
Figure 4~5
AI summary
The method involves rolling and folding of multiple bearings with longitudinally corresponding sections (2.1 to 2.4) of conductors (2). The conductors are attached, inserted, rolled and folded in a flexible, electrically insulated substrate (3) such that the flat coil or multiple flat coils are produced on the bearing of the substrate. An independent claim is included for a coil manufactured by a method.