Flexible Electronic Component Adhesion via Interlayer Anchoring
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Solution Overview
Problem
The mechanical stress during the production of electronic components with flexible substrates often leads to partial or complete detachment of layers due to insufficient adhesion, and the use of adhesion promoter layers can impair the component's functionality.
Innovation Solution
A configuration where the second material has openings that allow the third material to connect with the first material, enhancing adhesion, with the third material having a stronger adhesive force than the second material, thereby anchoring the second material and improving the bonding between layers without using adhesion promoter layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesion promoter layers are used to improve layer bonding, then adhesion between layers is improved, but the component's functionality is impaired
Solution Approach 1:
The patent uses the third material as an intermediary substance that forms a bridge between the first and second materials. This intermediary layer provides adhesion promotion without using traditional adhesion promoter layers that would impair functionality. The third material's stronger adhesive force to the first material creates a reliable bonding interface while maintaining component performance.
Solution Approach 2:
The patent changes the adhesive force parameter by selecting a third material with specifically stronger adhesion to the first material compared to the second material's adhesion. This parameter change allows the system to achieve necessary bonding strength without introducing harmful adhesion promoter layers that would compromise functionality.
2Adaptability or versatility
If the substrate is made flexible for better adaptability, then mechanical stress during production increases, but layer detachment risk increases
Solution Approach 1:
The patent applies preliminary action by pre-establishing strong adhesion bonds between layers through the strategic selection of materials with appropriate adhesive forces. The third material is chosen to have stronger adhesion to the first material before any mechanical stress is applied during production, preventing layer detachment in advance.
Solution Approach 2:
The patent employs composite material principles by creating a multi-material stack where each material is selected for its specific adhesive properties. The combination of first, second, and third materials with different adhesive forces creates a composite structure that maintains layer integrity even when the substrate is flexible and subjected to mechanical stress.
3Ease of manufacture
If thinner layers are used to reduce production costs, then manufacturing precision requirements increase, but adhesion stability decreases
Solution Approach 1:
The patent changes the adhesive force parameter by introducing a third material with stronger adhesion to the first material. This parameter change compensates for the reduced thickness of layers, allowing thinner layers to be used while maintaining adequate adhesion stability and reducing production costs.
4Reliability
If the second material is made continuous for better functionality, then flexibility of the component decreases, but adhesion to substrate becomes more uniform
Solution Approach 1:
The patent applies local quality by creating non-continuous (patterned or segmented) second material structures rather than continuous layers. This allows different regions to have different properties: areas with second material provide functionality, while gaps or reduced thickness areas provide flexibility. The third material ensures adhesion in both continuous and non-continuous configurations.
Data Source
Figure 1a~1b
Figure 2a~2c
Figure 3a~3c
AI summary
The invention relates to an electronic component with a flexible substrate, on the surface of which a layer stack of thin layers, comprising at least one electrical function layer, made from an electrically conducting or semi-conducting material is arranged. The component comprises at least one first material, a second material in the form of a layer and a third material in the form of a layer and, viewed perpendicular to the surface of the substrate, the second material follows on the first material and the third material follows on the second material, wherein a first adhesion force between the second material and the first material is lower than a second adhesion force of the third material to the first material and the second material comprises at least one opening by means of which the third material is connected to the first material in order to increase the adhesion of the second material to the first material.