Flexible Conductive Device Adhesive Layering for Crack Resistance
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Solution Overview
Problem
Flexible conductive devices used in soft robotic applications often suffer from cracking due to flexing and thermal expansion, leading to short lifetimes and inconsistent function.
Innovation Solution
A flexible conductive device comprising a polymer base with a poly-para-xylylene layer bonded by a first adhesive layer and a conductive layer bonded to the poly-para-xylylene layer with a second adhesive layer, providing robustness and durability against flexing and thermal expansion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a conductive layer is placed on a polymer substrate for flexible applications, then the device achieves flexibility and conformability, but the conductive layer cracks during flexing and thermal expansion leading to short lifetime
Solution Approach 1:
The patent employs multiple thin film layers including a polymer base layer, poly-para-xylylene layer, and adhesive layers that are all designed to be flexible and thin. These thin films maintain conformability while preventing cracking through their inherent flexibility and thinness, allowing the conductive layer to flex without breaking
Solution Approach 2:
The patent creates a composite structure consisting of multiple different materials: polymer base layer, poly-para-xylylene layer, adhesive layers, and conductive layer. Each material is selected for its specific properties, and their combination creates a composite structure that provides both flexibility and crack resistance, resolving the contradiction between adaptability and reliability
2Reliability
If the conductive layer is made robust to withstand flexing, then the device lifetime increases, but the device loses flexibility and conformability
Solution Approach 1:
The patent uses thin film structures for all layers including the conductive layer, adhesive layers, and polymer base. These thin films maintain flexibility while providing sufficient mechanical strength and durability. The thinness ensures conformability while the material selection and layering provide robustness against flexing and thermal expansion
Solution Approach 2:
The patent divides the device into multiple separate layers: polymer base layer, poly-para-xylylene layer, first adhesive layer, second adhesive layer, and conductive layer. This segmentation allows each layer to be optimized independently - the conductive layer can be made durable while the adhesive and polymer layers provide flexibility, and the layers work together to maintain both properties simultaneously
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a robust, flexible, and conformable substrate for force sensors that can withstand normal use and thermal changes, extending the device's lifetime and ensuring consistent function.
Implementation Method 1
a poly-para-xylylene layer which is bonded to the polymer base by a first adhesive layer and a conductive layer which is bonded to the poly-para-xylylene layer by a second adhesive layer
Data Source
AI summary
A flexible conductive or electronic device comprising a polymer base, a poly-para-xylylene layer which is bonded to the polymer base by a first adhesive layer and a conductive layer which is bonded to the poly-para-xylylene layer by a second adhesive layer.