Flexible Conductive Layer Layout for Low-Noise Bio-Signal Sensing

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Solution Overview

Problem

Noise and interference issues exist in electronic devices due to long transmission paths, affecting transmission properties and sensing quality in wearable devices.

Innovation Solution

The electronic device incorporates a circuit structure with electronic components on one side and a flexible conductive layer on the other, with conductive elements connecting them, allowing for improved signal transmission and sensing quality by optimizing the distribution of conductive materials.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If signals are transmitted through conductive elements over long transmission paths, then the electronic device can collect and transmit health signals, but noise and interference problems become severe, affecting transmission properties and sensing quality

Engineering Contradiction:
Improvesensing qualityVSAvoidnoise and interference
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent transitions from planar conductive traces to three-dimensional conductive pillars that extend vertically through the substrate. This dimensional change allows the conductive elements to penetrate multiple layers (first substrate, second substrate, encapsulant) and establish direct electrical connections between electrodes on opposite sides, thereby shortening the effective transmission path and reducing noise and interference in the signal transmission path

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The conductive pillars act as intermediary elements that bridge the gap between electrodes on different substrates. These pillars are embedded within the encapsulant material, which serves as a mediator providing both mechanical support and electrical insulation, thereby enabling reliable signal transmission through the multi-layer structure while minimizing interference

Inventive Principle:
Principle #24Intermediary (Mediator)

2Productivity

If conductive elements are placed close to the circuit structure, then transmission efficiency is improved, but the flexible conductive layer may interfere with circuit operations

Engineering Contradiction:
Improvetransmission efficiencyVSAvoidinterference with circuit operations
Core Design Contradiction:
ProductivityVSObject-generated harmful factors

Solution Approach 1:

The patent implements local quality by positioning conductive pillars specifically at regions where electrical connections are needed (between electrodes and circuit elements) while maintaining flexible conductive layers at other regions for sensing purposes. The conductive elements are strategically placed to establish electrical pathways without creating continuous conductive paths that would cause interference, thereby achieving both efficient transmission and circuit compatibility

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration reduces signal noise and improves transmission efficiency, ensuring uniform distribution of conductive fillers and enhancing sensing quality in wearable devices.

Implementation Method 1

The conductive paste is configured to detect a bio-signal

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS20260025928A1Electronic device
Publication Date: 2026.01.22 ADVANCED SEMICON ENG INC
  • US20260025928A1 patent drawing
  • US20260025928A1 patent drawing
  • US20260025928A1 patent drawing

AI summary

The present disclosure provides an electronic device. The electronic device includes a circuit structure, an electronic component, a flexible conductive layer, and a conductive element. The circuit structure has a first surface and a second surface opposite to the first surface. The electronic component is under the first surface. The flexible conductive layer is over the second surface. The conductive element extends toward a direction far away from the second surface and connected to the flexible conductive layer. The conductive element is embedded within at least two different materials.