Flexible Conductive Covering for EMI Shielding and Thermal Bridging
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Solution Overview
Problem
The increasing clock frequencies in electronic devices lead to electromagnetic interference (EMI) and heat energy losses, posing safety risks, particularly in motor vehicles, where traditional electromagnetic shielding solutions require a gap for heat dissipation, which contradicts the need for reduced device height.
Innovation Solution
An electrically conductive frame and covering are used to create an electromagnetic shielding arrangement where the covering is attached to both the component and the frame, potentially with apertures, to bridge height offsets without gaps, using flexible metal foils and conductive adhesives for efficient heat and electromagnetic shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a rigid lid is attached to the frame to provide electromagnetic shielding, then shielding reliability is improved, but device height increases due to the required gap for heat dissipation
Solution Approach 1:
The patent replaces the rigid lid with a flexible conductive covering (foil) that can conform to the component top surface. This flexible covering provides electromagnetic shielding while eliminating the need for a height gap, as it can be attached directly to the component top regardless of height variations. The flexibility allows it to adapt to the component shape while maintaining continuous electrical contact for shielding purposes.
Solution Approach 2:
The patent introduces a flexible, adaptable covering that can dynamically adjust to the component's top surface geometry. Unlike a rigid lid that requires a fixed gap, the flexible covering can conform to varying heights and shapes, providing consistent shielding coverage without increasing device height. The covering's flexibility allows it to maintain effective shielding while adapting to manufacturing tolerances.
2Reliability
If the frame top side projects beyond the component top side to ensure coverage despite height variations, then shielding coverage is improved, but a gap is formed requiring heat-conducting medium
Solution Approach 1:
Instead of having the frame project beyond the component (traditional approach), the patent inverts the approach by having the flexible covering extend beyond the frame edges. This inverted configuration allows the covering to provide shielding coverage while maintaining direct thermal contact with the component top surface, eliminating the need for separate heat-conducting media.
Solution Approach 2:
The flexible conductive covering serves multiple functions simultaneously: it provides electromagnetic shielding, bridges height variations between frame and component, and acts as a thermal conduction path. By combining these functions into a single element, the patent eliminates the need for separate heat-conducting media while maintaining both shielding coverage and thermal management.
3Temperature
If a heat-conducting medium is used to bridge the gap for heat dissipation, then heat dissipation is improved, but device height increases
Solution Approach 1:
The patent merges the electromagnetic shielding function and thermal conduction function into a single flexible covering element. The conductive foil simultaneously provides EMI shielding and serves as a thermal pathway from the component top to the frame, eliminating the need for separate heat-conducting media that would increase device height.
Solution Approach 2:
The flexible conductive foil can be attached directly to the component top surface and extends to the frame, providing both shielding and thermal conduction in a thin profile. This thin-film approach enables effective heat dissipation without adding significant height to the device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively minimizes the overall height of electronic devices while ensuring reliable electromagnetic shielding and heat dissipation, addressing the safety risks associated with EMI and heat energy losses.
Implementation Method 1
an electrically conductive covering (32) which is attached at least to a portion of a top side (24) of the component (12) and which is electrically conductively attached at least to a portion of the frame (10)
Implementation Method 2
the gap is thermally bridged by a heat-conducting medium (e.g. a heat-conducting paste)
Data Source
AI summary
An arrangement for electromagnetic shielding of an electronic component attached to a substrate is described. The arrangement comprises an electrically conductive frame which is attached to the substrate in such a way that the frame frames the component. The arrangement further comprises an electrically conductive covering which is attached at least to a portion of a top side of the component, and which is electrically conductively attached at least to a portion of the frame. Furthermore, a method for electromagnetic shielding of the electronic component attached to the substrate and also a computer program product for carrying out the method are described.