Flexible Conductive Plate Vacuum Alignment for Power Modules
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Solution Overview
Problem
Power semiconductor modules face challenges due to manufacturing tolerances that lead to mechanical stresses and reduced space for semiconductor components, as precise alignment of printed circuit boards is often difficult, resulting in costly assembly and potential damage.
Innovation Solution
A power semiconductor module design incorporating a flexible conductive plate with connection feet that are vacuum-sucked and mechanically bonded to the semiconductor substrate, allowing for precise positioning and connection without the need for extensive space on the substrate, using a vacuum chamber and connection unit for automated alignment and bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a printed circuit board is used for electrical connections, then electrical connectivity is achieved, but manufacturing tolerances cause misalignment and mechanical stresses
Solution Approach 1:
The patent changes the physical state and properties of the conductive element from rigid (printed circuit board) to flexible (conductive foil with terminal feet). This flexibility allows the terminal feet to adapt to position deviations caused by manufacturing tolerances, absorbing misalignment without creating mechanical stresses, thus maintaining reliable electrical connections while compensating for precision limitations.
Solution Approach 2:
The patent introduces a dynamic, flexible conductive structure that can adapt its shape during assembly. The terminal feet of the conductive foil are designed to be deformable, allowing them to bend and align with connection surfaces even when there are manufacturing tolerances. This dynamic adaptation eliminates the rigid alignment requirements of traditional printed circuit boards.
2Adaptability or versatility
If larger connecting areas are provided on substrates to compensate for tolerances, then alignment flexibility is improved, but space for semiconductor components is reduced
Solution Approach 1:
The patent divides the connection function into separate elements: the conductive foil with multiple terminal feet is separated from the substrate. Each terminal foot can be independently sized and positioned, allowing minimal connection areas on the substrate while maintaining alignment flexibility through the flexible nature of the terminal feet themselves. This segmentation eliminates the need for large dedicated connection areas on the substrate.
Solution Approach 2:
The patent changes the flexibility parameter of the conductive element, transforming it from a rigid printed circuit board requiring large connection areas to a flexible conductive foil with deformable terminal feet. This flexibility allows the terminal feet to compensate for position deviations without requiring enlarged connection areas on the substrate, thus preserving maximum space for semiconductor components.
3Measurement precision
If precise alignment is required for connection, then connection accuracy is improved, but assembly complexity and cost increase
Solution Approach 1:
The patent enables the conductive foil to perform self-alignment through its flexible terminal feet. During assembly, the terminal feet naturally bend and conform to the connection surfaces on the substrate, achieving accurate alignment without requiring complex external alignment devices or procedures. This self-service mechanism simplifies the assembly process while maintaining high connection accuracy.
Solution Approach 2:
The patent changes the mechanical properties of the conductive element to be flexible and deformable. This parameter change allows the terminal feet to automatically adapt to position variations during assembly, achieving accurate connections through material compliance rather than through complex alignment mechanisms, thereby reducing assembly complexity and cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces mechanical stresses and maximizes space for semiconductor components by enabling precise and automated connection of the flexible conductive plate to the semiconductor substrate, improving assembly efficiency and reducing costs.
Implementation Method 1
the vacuum chamber having at least a first opening for sucking an end portion of a terminal foot of a flexible conductive plate at a first end
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
An arrangement comprising a housing (904), at least one vacuum chamber (906) arranged in the housing (904), wherein the vacuum chamber (906) has at least one first opening (9041) for drawing in an end section (53) of a connecting foot (52) of a flexible conductive plate (50) at a first end, and a second opening (9042) for generating a vacuum in the vacuum chamber (906) at a second end opposite the first end, and a connecting unit (908) configured to establish a mechanical connection between the end section (53) and a semiconductor substrate (10) in a region in which the end section (53) is drawn into the first opening (9041), wherein the semiconductor substrate (10) comprises a dielectric insulating layer (11), a first electrically conductive layer (111),a plurality of semiconductor devices (20) arranged on the first electrically conductive layer and a plurality of contact surfaces (60) arranged on the first electrically conductive layer (111).