Electronic Component Packaging With Flexible Vertical Conductors
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Solution Overview
Problem
Electronic components face damage from thermal stress due to rigid electrical connections between the circuit board and components, which crack under differing thermal expansion rates.
Innovation Solution
An electronic component design featuring a substrate with conductor regions and chip regions, a packaging layer with cavities containing gas or elastic material, and vertical electrical conductors embedded in elastic material, allowing for movement to accommodate thermal expansion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If rigid electrical connections are used between the circuit board and electronic component, then stable electrical contact is achieved, but the connections crack under thermal stress due to differential thermal expansion
Solution Approach 1:
The patent introduces a dynamic element (the layer of elastic material) between the rigid electrical connection and the circuit board, allowing the connection to adapt its shape dynamically in response to thermal expansion forces while maintaining electrical contact
Solution Approach 2:
The patent changes the physical parameter of the connection structure by introducing an elastic material layer that can deform, transforming the rigid connection into a semi-rigid connection that can accommodate dimensional changes during thermal cycling
2Strength
If a laminated sequence of layers is used to provide flexibility to the module, then thermal stress resistance is improved, but the manufacturing process becomes complex with many consecutive lamination steps
Solution Approach 1:
The patent extracts the flexibility function from a complex multi-layer laminated structure and concentrates it into a single layer of elastic material, maintaining the thermal stress resistance while dramatically simplifying the manufacturing process
Solution Approach 2:
The patent applies the elastic material locally only in the conductor regions where flexibility is needed, rather than making the entire package structure complex and laminated, thus achieving flexibility without unnecessary manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design maintains electrical contact despite thermal stress by allowing vertical electrical conductors to tilt or bend, reducing the risk of damage from differential thermal expansion.
Implementation Method 1
The circuit board may for example undergo heat expansion. If the electronic component expands less than the circuit board, the rigid electrical connections between the circuit board and an electronic component mounted on the circuit board may crack.
Data Source
AI summary
A device is provided that includes a substrate defined as a horizontal xy-plane and a vertical z-direction perpendicular to the horizontal xy-plane. The substrate includes a second and first side. The device may include a conductor region and a chip region in the horizontal xy-plane. The device may include one or more chips attached to the at least one chip region on the substrate. The device may include a packaging layer including a second side and a first side, wherein the second side of the packaging layer is attached to the first side of the substrate, wherein the packaging layer further includes one or more cavities in the at least one conductor region, and the one or more cavities extend from the first side of the packaging layer to the second side of the packaging layer, and wherein each of the one or more cavities contains a gas.