Flexible Conductor Shield for PCB EMI and Thermal Management
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Solution Overview
Problem
Existing electronic circuit board shielding methods are inefficient in blocking electromagnetic waves and can function as high-efficiency antennas, leading to electromagnetic interference and poor heat exchange due to closed spaces, increasing device size and power consumption.
Innovation Solution
The solution involves arranging conductor parts that can extend and contract on a ground pattern around electronic components, secured by a conductive plate with springs, to create a narrow enclosure that prevents electromagnetic wave leakage and allows for effective heat exchange.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If shield material is used to enclose electronic components, then electromagnetic wave radiation is blocked, but heat exchange efficiency deteriorates due to closed spaces
Solution Approach 1:
The shield is divided into multiple segments with gaps between them, allowing heat exchange while maintaining electromagnetic shielding. Each segment is positioned to create a narrow enclosure that blocks electromagnetic waves but permits thermal convection through the gaps.
Solution Approach 2:
Different regions of the shield structure have different properties: the shield material itself provides electromagnetic blocking, while the gaps between segments provide thermal exchange pathways. The conductor parts have specific electrical conductivity requirements for shielding while allowing thermal conduction.
2Ease of manufacture
If cutouts are provided in shield part to avoid wiring and components, then ease of manufacture is improved, but electromagnetic wave radiation increases due to slit antenna formation
Solution Approach 1:
The shield uses flexible conductor parts that can be conformally attached to the PCB surface, eliminating the need for cutouts. The conductor parts have standing state capability that allows them to adapt to the surface topology while maintaining continuous shielding.
Solution Approach 2:
The conductor parts have extendable and contractible properties, allowing them to dynamically adapt to the presence of components and wiring without requiring fixed cutouts. This dynamic capability enables the shield to maintain continuity while accommodating various component layouts.
3Object-affected harmful factors
If conductor parts are arranged in standing state with extendable and contractible capability, then electromagnetic shielding is improved, but device complexity increases
Solution Approach 1:
The conductor parts have self-adapting properties that allow them to automatically conform to the PCB surface and maintain optimal shielding configuration without complex adjustment mechanisms. The standing state capability provides inherent adaptability to surface variations.
Solution Approach 2:
The conductor parts can change their physical state between standing, extended, and contracted configurations, allowing a single component design to serve multiple functional requirements and reduce overall system complexity.
4Object-affected harmful factors
If shield encloses entire printed board, then electromagnetic shielding is improved, but heat exchange efficiency deteriorates and device size increases
Solution Approach 1:
The complete shield is segmented into multiple parts with gaps, creating a structure that provides electromagnetic shielding while permitting heat exchange. This segmentation allows thermal convection paths while maintaining shielding effectiveness through the narrow enclosure geometry.
Solution Approach 2:
Instead of completely enclosing the PCB, the shield provides partial enclosure that is sufficient for electromagnetic shielding but leaves gaps for heat exchange. The conductor parts are positioned to provide adequate shielding coverage without excessive enclosure that would impede thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively blocks electromagnetic interference, reduces device size, and lowers power consumption by enabling high-efficiency heat exchange through exposure to gases, while preventing the formation of slit antennas that could radiate electromagnetic waves.
Implementation Method 1
Due to the electric field and magnetic field of electromagnetic waves 4 radiated from the surface of LSI 2, current 7 is generated in the surface of shield part 5
Implementation Method 2
Due to the skin effect of shield part 5 that has a fixed thickness, current 7 only flows over the surface of the other side that is irradiated by electromagnetic wave 4
Implementation Method 3
a plurality of conductor parts that can extend and contract arranged in a standing state on a ground pattern that surrounds an electronic component
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
The present invention has the object of providing a technology that can facilitate inexpensive shields of individual electronic components with good heat exchange efficiency, the electronic circuit board according to the present invention being provided with: a plurality of conductor parts in a standing state that can extend and contract on a ground pattern that surrounds an electronic component on the electronic circuit board, a conductive plate, and securing members for holding the plate such that the plurality of conductor parts contact the plate in a state in which the conductor parts contract from their natural length.