Flexible Connection Board for Electronic Component Module Shielding

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Solution Overview

Problem

The challenge is to design an electronic component module that can be mounted in confined spaces of portable devices while minimizing size and weight, requiring innovative configurations for components and shielding to ensure effective electromagnetic wave shielding and reliable bonding.

Innovation Solution

The solution involves a modular design with a first module having a sealing portion and a shielding layer on a flexible connection board, where the shielding layer is connected to the ground line, and a second module with an antenna, allowing for reduced size and increased flexibility in placement, along with a shielding wall for enhanced electromagnetic shielding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If a rigid board structure is used for mounting electronic components, then structural stability is improved, but flexibility and adaptability to confined spaces deteriorates

Engineering Contradiction:

Improvestructural stabilityVSAvoidflexibility

Core Design Contradiction:

Stability of the object's compositionVSAdaptability or versatility

Solution Approach 1:

The electronic component module is divided into a first module (with sealing portion and electronic components) and a second module (with antenna), connected by a flexible connection board. This segmentation allows the rigid first module to maintain structural stability while the flexible connection board provides adaptability to confined mounting spaces.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The connection board is designed with flexible properties, allowing it to bend and adapt to different mounting configurations. This dynamic characteristic enables the module to be installed in confined spaces while the first module maintains its rigid structure for stability.

Inventive Principle:

Principle #15Dynamics

2Object-affected harmful factors

If shielding layer is extended to connect to ground line, then electromagnetic shielding effectiveness is improved, but bonding reliability deteriorates due to surface roughness

Engineering Contradiction:

Improveelectromagnetic shielding effectivenessVSAvoidbonding reliability

Core Design Contradiction:

Object-affected harmful factorsVSReliability

Solution Approach 1:

The shielding layer is selectively extended only in the region where it needs to connect to the ground line, rather than uniformly across the entire surface. This local extension achieves electromagnetic shielding effectiveness while minimizing the impact of surface roughness on bonding reliability in other critical bonding regions.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The ground line serves as an intermediary element that connects the shielding layer to the ground layer of the first board. This intermediary connection allows the shielding layer to be electrically connected to ground without requiring direct bonding over large rough surfaces, thus maintaining bonding reliability while achieving shielding effectiveness.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Volume of moving object

If multiple electronic components are integrated in one module, then device size is reduced, but manufacturing complexity increases

Engineering Contradiction:

Improvedevice sizeVSAvoidmanufacturing complexity

Core Design Contradiction:

Volume of moving objectVSDevice complexity

Solution Approach 1:

The module is segmented into functional units: the first module containing electronic components mounted on the first board, the sealing portion enclosing these components, and the second module with the antenna. This segmentation reduces overall device size while allowing each segment to be manufactured and tested separately, managing manufacturing complexity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Multiple electronic components are merged and mounted on the first board within the sealing portion, integrating them into a compact first module. This merging reduces the number of separate components and connections needed, thereby reducing overall device size while the modular structure keeps manufacturing complexity manageable.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively shields electromagnetic waves, improves bonding reliability, and allows for compact integration of components within the module, addressing the need for miniaturization and weight reduction in portable devices.

Implementation Method 1

a shielding layer disposed on a surface of the sealing portion

Methodology Applied

Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentUS11477879B2Electronic component module and electronic device including the same

Publication Date: 2022.10.18 SAMSUNG ELECTRO MECHANICS CO LTD

AI summary

An electronic component module includes a first module including a sealing portion disposed on a first surface of a first board and a shielding layer disposed on a surface of the sealing portion, a second module spaced apart from the first module, a connection board having greater flexibility than the first board and connecting the first module to the second module, and a first ground line electrically connected to a ground layer of the first board and disposed on a surface of the connection board, and at least a portion of the shielding layer is electrically connected to the ground layer of the first board.