Flexible Connector Integrated IC Packages
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Solution Overview
Problem
The challenge lies in packaging integrated circuit (IC) components in mobile devices and IoT devices with odd or curved shapes, where traditional methods result in large, costly, and misaligned assemblies due to separate fabrication and assembly of distinct components.
Innovation Solution
An integrated device with a flexible connector that includes a dielectric layer and interconnect extending into laminated substrates, allowing for a compact, cost-effective, and precisely aligned connection between IC packages, eliminating the need for extra interfaces and enabling finer pitch and spacing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If separate fabrication and assembly of distinct components (IC packages and flexible connector) is used, then ease of manufacture is improved, but device size and fabrication cost increase
Solution Approach 1:
The patent merges the flexible connector with the IC packages by having the dielectric layer and interconnect substantially extend into the laminated substrates of both IC packages. This integration eliminates the need for separate assembly of distinct components, reducing overall package size while maintaining manufacturability through a unified fabrication process.
2Ease of operation
If traditional assembly methods with extra interfaces are used, then ease of assembly is improved, but connection precision and alignment decrease
Solution Approach 1:
The patent merges the flexible connector with the IC packages by having the interconnect substantially extend into the laminated substrates, eliminating extra interfaces between separate components. This integration achieves higher connection precision and alignment accuracy while maintaining ease of assembly through a unified structure.
Solution Approach 2:
The patent achieves precise alignment by extending the interconnect into the laminated substrates in the vertical dimension, rather than relying on surface-level interfaces. This dimensional approach enables finer pitch and spacing while maintaining manufacturing precision.
3Ease of operation
If traditional assembly methods with extra interfaces are used, then ease of assembly is improved, but misalignment occurs
Solution Approach 1:
The patent merges the flexible connector with the IC packages into a single integrated structure, eliminating extra interfaces that cause misalignment. This integration ensures accurate alignment between IC packages while maintaining ease of assembly through a unified fabrication process.
Data Source
AI summary
Some features pertain to an integrated device that include a first integrated circuit (IC) package comprising a first laminated substrate, a flexible connector coupled to the first laminated substrate, and a second integrated circuit (IC) package comprising a second laminated substrate. The second laminated substrate is coupled to the flexible connector. The flexible connector includes a dielectric layer and an interconnect. The dielectric layer and the interconnect substantially extend into the first laminated substrate and the second laminated substrate. In some implementations, the dielectric layer and the interconnect of the flexible connector, contiguously extend into the first laminated substrate and the second laminated substrate. In some implementations, the dielectric layer extends into a substantial portion of the first laminated substrate. In some implementations, the dielectric layer includes polyimide (PI) layer.