Flexible Connector with Shared Dielectric Layer for IC Packages
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Solution Overview
Problem
The challenge lies in packaging integrated circuit (IC) components in mobile devices and IoT devices with odd or curved shapes, where traditional rigid-flex modules are expensive and result in large packages, necessitating a more compact, cost-effective, and accurately connected solution.
Innovation Solution
An integrated device with a flexible connector that shares a dielectric layer with both IC packages, providing mechanical and structural coupling, and using a dummy metal layer to form a contiguous connection, allowing for a compact form factor and precise alignment during fabrication.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If rigid-flex modules are used to accommodate odd or curved shapes, then adaptability to device shapes is improved, but device size and fabrication cost increase
Solution Approach 1:
The patent merges the flexible connector with the IC packages by sharing a common dielectric layer, creating an integrated structure where the connector and packages are fabricated together as a single unit. This eliminates the need for separate rigid-flex modules while maintaining adaptability to odd or curved device shapes.
Solution Approach 2:
The shared dielectric layer serves multiple functions simultaneously: it acts as the insulating layer for the IC packages, provides the flexible substrate for the connector, and enables mechanical coupling between packages. This multi-functionality reduces overall package size while maintaining shape adaptability.
2Adaptability or versatility
If rigid-flex modules are used to accommodate odd or curved shapes, then adaptability to device shapes is improved, but fabrication cost increases
Solution Approach 1:
The patent combines the fabrication processes for IC packages and flexible connectors into a single integrated manufacturing flow. By fabricating both components together on the same dielectric layer, the number of fabrication steps is reduced, eliminating expensive assembly operations and lowering overall manufacturing costs while maintaining shape adaptability.
Solution Approach 2:
The shared dielectric layer structure allows a single fabrication process to produce multiple functional components (packages and connectors) simultaneously. This universal approach to manufacturing reduces process complexity and cost while enabling adaptability to various device shapes.
3Ease of manufacture
If distinct components are fabricated separately and assembled, then manufacturing flexibility is improved, but device size and fabrication cost increase
Solution Approach 1:
The patent merges separate fabrication processes into a unified manufacturing approach where IC packages and flexible connectors are created together in the same process flow on a shared dielectric layer. This integration reduces the number of discrete components and assembly steps, resulting in a more compact final package.
Data Source
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AI summary
Some features pertain to an integrated device that includes a first integrated circuit (IC) package, a flexible connector and a second integrated circuit (IC) package. The first integrated circuit (IC) package includes a first die, a plurality of first interconnects, and a first dielectric layer encapsulating the first die. The flexible connector is coupled to the first integrated circuit (IC) package. The flexible connector includes the first dielectric layer, and an interconnect. The second integrated circuit (IC) package is coupled to the flexible connector. The second integrated circuit (IC) package includes the first dielectric layer, and a plurality of second interconnects. The first integrated circuit (IC) package, the second integrated circuit (IC) package, and the flexible connector are coupled together through at least a portion (e.g., contiguous portion) of the first dielectric layer. In some implementations, the flexible connector comprises a dummy metal layer.