Flexible Connecting Member Layout for Foldable Signal Integrity
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Solution Overview
Problem
Foldable and rollable electronic devices experience signal loss and reduced lifespan due to impedance changes and stress accumulation in flexible circuit boards, especially when equipped with ultra-high frequency communication modules.
Innovation Solution
A flexible connecting member with a dielectric substrate and spaced signal and ground wires maintains impedance and reduces stress on the flexible circuit board, enhancing durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a flexible circuit board is used to connect electric elements in foldable devices, then the device can be folded and space utilization is improved, but impedance changes occur causing signal loss
Solution Approach 1:
The patent applies local quality by creating a ground wire structure with different characteristics in different regions. The ground wire includes a first portion and a second portion with different distances from the signal wire, allowing localized impedance control. This enables the flexible circuit board to maintain proper impedance characteristics in critical areas while preserving overall foldability.
Solution Approach 2:
The patent changes geometric parameters of the ground wire structure to control impedance. By adjusting the distance between the ground wire and signal wire, and modifying the width and shape of ground wire portions, the impedance can be maintained at desired levels despite the flexible nature of the circuit board.
2Duration of action of moving object
If the flexible circuit board is repeatedly folded, then the device can be used multiple times, but stress accumulates reducing lifespan
Solution Approach 1:
The patent implements beforehand cushioning by designing a ground wire structure that anticipates and compensates for bending stresses. The specific configuration of ground wire portions provides mechanical support and stress distribution in advance, preventing damage accumulation during repeated folding operations.
3Manufacturing precision
If the ground wire is placed close to the signal wire, then impedance control is improved, but conductor influence and signal interference increase
Solution Approach 1:
The patent applies local quality by creating different spatial relationships between ground wire and signal wire in different regions. The first portion of the ground wire is positioned at a first distance from the signal wire, while the second portion is positioned at a second distance, allowing localized impedance control while minimizing overall interference.
Solution Approach 2:
The patent resolves the contradiction by transitioning from a single-distance ground wire configuration to a multi-distance configuration. By utilizing the spatial dimension more effectively with ground wire portions at different distances, the patent achieves both impedance control and interference reduction.
Data Source
AI summary
An electronic device is provided. The electronic device includes a housing, and a flexible connecting member disposed inside the housing, the flexible connecting member including a dielectric substrate, at least one signal wire disposed on one surface of the dielectric substrate, and at least one ground disposed on the other surface of the dielectric substrate adjacent to the signal wire. The at least one signal wire and the at least one ground is disposed to be spaced apart from each other when viewed from above the dielectric substrate. A flexible connecting member includes a dielectric substrate, a signal wire disposed on one surface of the dielectric substrate, and a ground disposed on the other surface of the dielectric substrate adjacent to the signal wire. The signal wire and the ground are disposed to be spaced apart from each other when viewed from above the dielectric substrate.