Flexible Monolithic Cooling Array for Semiconductor Height Variations
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Solution Overview
Problem
Existing semiconductor cooling apparatuses face inefficiencies in heat transfer due to vertical height variations among semiconductor elements, as conventional heat spreaders are inefficient and difficult to accurately map and fit, particularly in arrays with diverse height variations.
Innovation Solution
A monolithic array of cooling elements that can independently flex to conform to the height of each semiconductor element, featuring a coolant supply and return manifold system, fabricated through diffusion bonding for improved thermal coupling and flexibility, allowing for efficient heat transfer across elements of varying heights.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional heat spreaders are used to accommodate vertical height variations, then some adaptability is achieved, but heat transfer efficiency deteriorates and manufacturing complexity increases due to mapping and fitting difficulties
Solution Approach 1:
The cooling element is designed with flexible material properties that allow it to dynamically adapt to varying semiconductor heights through elastic deformation. The flexible substrate enables the cooling element to conform to different vertical profiles without requiring custom fabrication for each height variation, thereby maintaining both adaptability and heat transfer efficiency.
Solution Approach 2:
The invention changes the physical parameters of the cooling element by using flexible materials with appropriate elastic moduli and thicknesses. This allows the cooling element to undergo controlled deformations that match the semiconductor height variations while maintaining optimal thermal contact, resolving the contradiction between adaptability and heat transfer efficiency.
2Adaptability or versatility
If custom heat spreaders are fabricated for each semiconductor element, then adaptability to height variations improves, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The flexible cooling element serves multiple functions: it provides thermal management, adapts to various semiconductor heights, and eliminates the need for custom fabrication. A single universal cooling element design can accommodate different semiconductor heights through elastic deformation, removing the complex mapping and fitting processes required by conventional custom heat spreaders.
Solution Approach 2:
The flexible cooling element performs self-adjustment through elastic deformation to match semiconductor heights without requiring external mapping or custom fabrication processes. The material's inherent elasticity allows it to automatically conform to the semiconductor surface, eliminating the need for complex measurement and customization procedures.
3Ease of manufacture
If rigid cooling elements are used, then manufacturing precision is easier to achieve, but adaptability to height variations deteriorates
Solution Approach 1:
The invention employs a flexible substrate as the base for the cooling element, allowing it to deform and conform to semiconductor height variations. This flexible film approach maintains manufacturing simplicity while achieving the necessary adaptability, as the flexible substrate can be fabricated with standard processes and will naturally conform to different surfaces through elastic deformation.
Solution Approach 2:
The cooling element is constructed as a composite structure with a flexible substrate and a thermal management layer. This composite design combines the ease of manufacturing flexible materials with the thermal performance requirements, allowing the cooling element to be manufactured with standard processes while maintaining the ability to adapt to height variations through the flexible base layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The flexible cooling elements reduce thermal resistance interfaces, enhance heat transfer efficiency, extend the life of semiconductor elements, and simplify installation by eliminating the need for customizations, thereby reducing costs and improving thermal performance.
Implementation Method 1
Each cooling element is configured to thermally couple to a respective semiconductor element of an array of semiconductor elements
Implementation Method 2
each cooling element is formable through a bonding process to form a monolithic structure. The bonding includes diffusion bonding
Data Source
AI summary
In some embodiments, a semiconductor cooling apparatus includes a monolithic array of cooling elements. Each cooling element of the monolithic array of cooling elements is configured to thermally couple to a respective semiconductor element of an array of semiconductor elements. At least two of the semiconductor elements have a different height and each cooling element independently flexes to conform to the height of the respective semiconductor element.