Flexible Cooling Hoses for Vibration Decoupling in Lithography
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Solution Overview
Problem
In semiconductor processing, the reduction of feature sizes and the need for high accuracy in lithographic apparatuses are compromised by external vibrations and heat loads, which challenge the decoupling of vibrations and effective cooling without compromising the design of substrate processing systems.
Innovation Solution
A substrate processing apparatus with a radiation projection system supported by a vibrationally decoupled frame, utilizing a fluid transfer system with a flexible portion that extends in two dimensions over the substrate support structure, allowing for effective decoupling of vibrations above a predetermined frequency while providing cooling, using materials like PFA and PTFE for the tubes and incorporating a stiffening member to maintain structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If active cooling by means of cooling fluid running through conduits is implemented, then heat load is reduced, but vibration decoupling is compromised
Solution Approach 1:
The patent employs flexible hoses instead of rigid cooling conduits to connect the radiation projection system to the cooling system. These flexible hoses act as vibration isolators while still allowing cooling fluid to flow through, thus maintaining both cooling effectiveness and vibration decoupling. The flexibility of the hoses prevents rigid mechanical connections that would transmit vibrations.
Solution Approach 2:
The flexible hose serves as an intermediary element between the radiation projection system and the cooling system. It mediates between the need for thermal management and the need for vibration isolation, allowing both functions to coexist without direct rigid coupling between the cooled component and the cooling infrastructure.
2Manufacturing precision
If feature sizes are reduced to increase manufacturing precision, then manufacturing precision is improved, but heat load increases
Solution Approach 1:
The cooling system is segmented into multiple independent flexible hose connections rather than using a single rigid conduit system. This segmentation allows for distributed cooling of different components while maintaining vibration isolation at each connection point, addressing both the precision and heat management requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution maintains the vibrational decoupling of the radiation projection system from external vibrations while enabling active cooling, ensuring the precision and reliability required for advanced semiconductor processing by attenuating vibrations and managing heat effectively.
Implementation Method 1
the stiffness of the flexible portion between the two points is adapted to substantially decouple vibrations at the second fixed point which are above the predetermined maximum frequency from the first fixed point
Implementation Method 2
active cooling by means of a cooling fluid running through one or more conduits
Data Source
AI summary
Support arrangement for supporting a radiation projection system in a substrate processing apparatus, the support arrangement comprising:a support body for supporting the radiation projection system;electrical wiring for supplying voltages to components within the radiation projection system and/or for supplying control data for modulation of radiation to be projected onto a target surface by the radiation projection system;optical fibers, for supplying control data for modulation of radiation to be projected onto a target surface by the radiation projection system, anda cooling arrangement comprising one or more fluid conduits for cooling the radiation projection system;the electrical wiring, the optical fibers, and the cooling arrangement being at least partly accommodated in and/or supported by the support body.