Flexible Liquid Cooling Loop Layout for Server Airflow and Upgrades
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Solution Overview
Problem
Existing liquid cooling systems face challenges with larger cooling lines obstructing airflow, hindering heat dissipation efficiency and server maintenance, and are costly and difficult to upgrade due to rigid tubing and bulky fittings.
Innovation Solution
A liquid cooling system utilizing flexible stainless steel tubing sections with lap joint fittings that reduce cooling line footprints, allowing easier component upgrades and rerouting, and includes a cooling distribution unit for efficient heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If larger and heavier duty cooling lines (rigid copper tubing or reinforced rubber tubing) are used to meet increasing heat dissipation requirements, then heat dissipation capability is improved, but airflow obstruction increases and heat dissipation efficiency decreases
Solution Approach 1:
The patent applies flexible thin-walled stainless steel tubing instead of rigid copper tubing or reinforced rubber tubing. The flexible tubing has thinner walls and smaller outer diameter, allowing it to bend around obstacles and pass through narrow spaces without obstructing airflow, while still maintaining structural integrity under pressure and achieving the required heat dissipation capability.
2Strength
If heavier and bulkier fittings and connectors are used in liquid cooling systems, then connection strength is improved, but airflow obstruction increases and access and maintenance of servers is hindered
Solution Approach 1:
The cooling line system is segmented into modular components (flexible tubing sections, fittings, connectors) that can be independently selected and assembled. This allows for compact fitting designs that maintain connection strength while minimizing space occupation, enabling better access to servers and easier maintenance operations.
Solution Approach 2:
The system employs flexible tubing that can dynamically adapt to space constraints and server configurations, allowing for compact routing that does not obstruct airflow or hinder access. The flexibility enables the cooling lines to be routed through narrow spaces and around components without requiring bulky fixed installations.
3Stability of the object's composition
If rigid cooling lines are used in proprietary servers, then structural stability is improved, but upgrading components and rerouting of cooling lines becomes extremely difficult
Solution Approach 1:
The patent replaces rigid cooling lines with flexible tubing that can be easily routed and reconfigured. The flexible tubing maintains structural stability under operating conditions while allowing for simple upgrades and rerouting by simply disconnecting and reconnecting sections, enabling adaptability for component upgrades and server reconfigurations.
Solution Approach 2:
The cooling system is divided into modular segments (tubing sections, fittings, connectors) that can be independently replaced or reconfigured. This segmentation allows for easy upgrading of components and rerouting of cooling lines without requiring complete system replacement, significantly improving adaptability while maintaining structural integrity through proper connection design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system enhances airflow, facilitates easier maintenance, and supports scalable cooling solutions by minimizing the footprint of cooling lines, enabling efficient heat dissipation and flexible integration with existing server designs.
Implementation Method 1
at least one flexible tubing section (210A, 210B, 210C) made of corrugated stainless steel
Implementation Method 2
A working fluid inside of a cold plate chamber absorbs and transfers heat away from the integrated circuit components
Implementation Method 3
A working fluid inside of a cold plate chamber absorbs and transfers heat away from the integrated circuit components
Implementation Method 4
A working fluid inside of a cold plate chamber absorbs and transfers heat away from the integrated circuit components
Implementation Method 5
Immersion cooling submerges the integrated circuit components in a dielectric immersion fluid, allowing for heat dissipation into the immersion fluid via direct contact
Data Source
Figure 1
Figure 2
Figure 3A~3B
AI summary
A liquid cooling system including a direct liquid cooling loop, system board, and cooling distribution unit is provided. The direct cooling loop includes a flexible tubing section, proximal fitting, distal fitting, and cold plate. A proximal connection end of the flexible tubing section is coupled to a proximal fitting attachment end of the proximal fitting via a proximal lap joint. A distal connection end of the flexible tubing section is coupled to a distal fitting attachment end of the distal fitting via a distal lap joint. The flexible tubing section is fluidly in communication with at least one of an inlet and outlet of the cold plate. A first integrated circuit components of the system board is physically and thermally coupled to the at least one direct liquid cooling loop via the cold plate. The cooling distribution unit is fluidly in communication with the at least one direct liquid cooling loop, providing a working fluid thereto.