Flexible Semiconductor Cooling Runners for Height Variation
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Solution Overview
Problem
Existing semiconductor cooling apparatuses face inefficiencies in heat transfer due to vertical height variations among semiconductor elements, as conventional heat spreaders are inefficient and difficult to accurately map and fit, leading to suboptimal cooling performance.
Innovation Solution
A semiconductor cooling apparatus featuring a thermal assembly with flexible heat exchangers and runners that conform to the height of each semiconductor element, coupled with a manifold for coolant supply and return, allowing for independent flexibility to maintain contact and enhance heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional rigid heat spreaders are used, then manufacturing is simplified, but heat transfer efficiency deteriorates due to inability to accommodate vertical height variations
Solution Approach 1:
The patent applies the dynamics principle by transitioning from rigid heat spreaders to flexible heat spreaders that can dynamically adapt to vertical height variations in semiconductor elements. The flexible heat spreaders are made from flexible materials or constructed with flexible structures that allow them to bend and conform to the actual topography of the semiconductor elements, thereby maintaining optimal thermal contact without requiring custom manufacturing for each variation.
Solution Approach 2:
The patent applies parameter changes by modifying the physical properties of the heat spreaders, specifically changing their flexibility parameter. By selecting materials or structures with appropriate flexibility characteristics, the heat spreaders can accommodate a range of heights in semiconductor elements while maintaining effective thermal contact, thus improving heat transfer efficiency without sacrificing ease of manufacture.
2Reliability
If custom heat spreaders are selected for each semiconductor element, then heat transfer efficiency is improved, but device complexity and installation time increase
Solution Approach 1:
The patent applies universality by designing a single type of flexible heat spreader that can serve multiple semiconductor elements with varying heights. Instead of manufacturing custom heat spreaders for each element, the flexible design allows one universal component to adapt to different configurations, thereby reducing device complexity and installation time while maintaining heat transfer efficiency.
Solution Approach 2:
The patent uses parameter changes in the flexibility of the heat spreaders to allow a universal design to accommodate various semiconductor element heights. By adjusting the flexibility parameter of the heat spreader material or structure, a single universal component can effectively contact elements with different vertical dimensions, eliminating the need for custom manufacturing.
3Adaptability or versatility
If flexible heat spreaders are used, then adaptability to height variations is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies dynamics by using flexible heat spreaders that can dynamically adapt to height variations, reducing the need for high manufacturing precision. The flexibility allows the heat spreaders to self-adjust to the actual positions of semiconductor elements, compensating for tolerances and variations without requiring extremely precise manufacturing.
Solution Approach 2:
The patent applies parameter changes by modifying the flexibility parameter of the heat spreaders, which allows them to accommodate manufacturing variations. By selecting appropriate flexibility characteristics, the system can tolerate broader manufacturing tolerances while still achieving effective thermal contact, thus improving adaptability without excessively increasing manufacturing precision requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution increases heat transfer efficiency, extends the life of semiconductor elements by ensuring proper cooling, reduces installation time and costs by eliminating the need for customizations, and allows for tighter component spacing.
Implementation Method 1
each flexible runner flexing to conform to a height of a respective semiconductor element and apply a force to the respective heat exchanger to maintain contact
Implementation Method 2
a heat exchanger configured to transfer heat from the semiconductor element to coolant flowing through the heat exchanger
Data Source
AI summary
An apparatus for cooling semiconductor elements uses heat exchangers to transfer heat from the semiconductor elements to a coolant flowing through the heat exchangers. A central body, made from a flexible material, is positioned between the heat exchangers and a manifold from which the coolant is provided. The central body includes a plurality of flexible runners fluidly coupled to each heat exchanger and the manifold to provide the coolant to the heat exchanger. Heat is transferred away from the semiconductor elements by the coolant and heated coolant is returned from the heat exchanger to the manifold. Each flexible runner is configured to flex to conform to a height of a respective semiconductor element and thereby apply a force to the heat exchanger to maintain contact with the semiconductor element.