Flexible Copper Clad Laminate for Vehicle LED Heat Dissipation

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Solution Overview

Problem

High luminance LED lamps in vehicles face heat dissipation issues, leading to increased failure rates and reduced lifespan due to inadequate thermal management, and conventional flexible copper-clad laminates with adhesives have compromised mechanical strength and heat dissipation characteristics.

Innovation Solution

A flexible copper-clad laminate for vehicle LED lamps is developed, comprising a copper-clad layer and a composite layer with a polyimide and thermoplastic polyimide layers, optimized for reduced thickness and thermal expansion, allowing for improved heat dissipation without additional ceramic fillers, maintaining mechanical strength and dimensional stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If heat dissipation filler is added to improve heat dissipation characteristic, then heat dissipation performance is improved, but mechanical strength of insulating layer deteriorates

Engineering Contradiction:
Improveheat dissipation characteristicVSAvoidmechanical strength of insulating layer
Core Design Contradiction:
TemperatureVSStrength

Solution Approach 1:

The patent uses a composite insulating layer combining polyimide resin with heat dissipation fillers (alumina, boron nitride, aluminum nitride) to achieve both improved heat dissipation and maintained mechanical strength. The composite structure allows thermal conductivity enhancement while the polyimide matrix preserves structural integrity.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent optimizes the thickness of the insulating layer and the content of heat dissipation filler to balance heat dissipation performance and mechanical strength. By controlling these parameters, the invention achieves excellent heat dissipation without excessive filler addition that would compromise mechanical properties.

Inventive Principle:
Principle #35Parameter changes

2Strength

If thickness of insulating layer is reduced to maintain mechanical strength, then mechanical strength is maintained, but heat dissipation characteristic deteriorates

Engineering Contradiction:
Improvemechanical strength of insulating layerVSAvoidheat dissipation characteristic
Core Design Contradiction:
StrengthVSTemperature

Solution Approach 1:

The composite insulating layer with heat dissipation fillers enables thin design while maintaining both mechanical strength and heat dissipation performance. The high thermal conductivity fillers compensate for the reduced thickness, allowing effective heat dissipation in a thin structure.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent applies heat dissipation fillers strategically within the insulating layer to create localized thermal management zones. This allows effective heat dissipation at critical areas without requiring uniform thick insulation throughout, maintaining both strength and thermal performance.

Inventive Principle:
Principle #3Local quality

3Adaptability or versatility

If adhesive layer is added to create 3-FCCL structure, then flexibility is improved, but heat dissipation characteristic deteriorates due to thickness and low thermal conductivity

Engineering Contradiction:
ImproveflexibilityVSAvoidheat dissipation characteristic
Core Design Contradiction:
Adaptability or versatilityVSTemperature

Solution Approach 1:

The patent minimizes the thickness of the adhesive layer and selects adhesive materials with improved thermal conductivity. By controlling the adhesive layer parameters, the invention maintains flexibility while reducing its negative impact on heat dissipation performance.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent introduces a thermally conductive adhesive or thermal interface material as an intermediary between the copper clad layer and the insulating layer. This intermediary improves heat transfer across the adhesive joint, mitigating the thermal resistance introduced by the flexible adhesive layer.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The laminate achieves excellent heat dissipation and mechanical properties, enabling the production of flexible, high-performance LED lamp circuit boards with reduced heat resistance and enhanced reliability.

Implementation Method 1

the copper-clad laminate for a vehicle LED lamp having excellent heat dissipation characteristics

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

optimized for reduced thickness and thermal expansion, allowing for improved heat dissipation without additional ceramic fillers, maintaining mechanical strength and dimensional stability

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS9970617B2Copper clad laminate for vehicle LED lamp, printed circuit board including the same, and manufacturing method thereof
Publication Date: 2018.05.15 HYUNDAI MOTOR CO LTD
  • US9970617B2 patent drawing
  • US9970617B2 patent drawing

AI summary

A flexible copper-clad laminate for a vehicle LED lamp is provided and includes a copper-clad layer and a composite layer that are laminated. The composite layer includes a polyimide layer and thermoplastic polyimide layers. An outermost layer of the composite layer is formed as a thermoplastic polyimide layer. A total thickness of the thermoplastic polyimide layers and an entire thickness of the polyimide layer with respect to a total thickness of the composite layer is about 10 to 50% and 50 to 90%, respectively. The total thickness of the thermoplastic polyimide layers and the entire thickness of the polyimide layer with respect to the thickness of the composite layer is about 20 to 40% and 60 to 80%, respectively. A thickness of the copper-clad layer is about 30 to 80 μm, and the total thickness of the composite layer is about 10 to 15 μm.