Flexible Coupling Tabs for Hermetic Module Interconnects
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Solution Overview
Problem
There is a need for dense interconnect options within sealed housings, such as hermetic microwave modules, that minimize vertical connections and eliminate feed-through holes to simplify integration and improve efficiency.
Innovation Solution
The solution involves a multilayer substrate with flexible coupling tabs that wrap around the central core to connect with a circuit card assembly, using perimeter passageways and a low-profile SMT connector to facilitate electrical connections without direct feed-through holes, allowing for high signal density and reduced alignment requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If feed-through holes are used to connect multilayer substrate with circuit card assembly, then electrical connection is achieved, but manufacturing complexity and alignment tolerance requirements increase
Solution Approach 1:
The connection path is segmented into two parts: the multilayer substrate with connection terminals on one side, and the circuit card assembly with corresponding connectors on the other side. This segmentation eliminates the need for complex feed-through holes spanning the entire assembly, reducing manufacturing complexity while maintaining reliable electrical connection through standardized connector interfaces.
2Reliability
If feed-through holes are used for direct connection, then electrical connection is established, but alignment tolerance requirements become stringent
Solution Approach 1:
Standardized connectors serve as intermediary elements between the multilayer substrate and circuit card assembly. These connectors provide robust mechanical and electrical interfaces that are tolerant to misalignment, eliminating the need for precision feed-through holes while ensuring reliable electrical connection through standardized mating interfaces.
3Productivity
If dense interconnect options are implemented within sealed housing, then integration efficiency improves, but connection density and signal routing complexity increase
Solution Approach 1:
The connection architecture transitions from planar routing within the sealed housing to a three-dimensional configuration where the multilayer substrate connects to the circuit card assembly through vertical or angled connection terminals. This dimensional change enables dense interconnects without increasing in-plane complexity, as connections are routed through the thickness of the assembly rather than across the housing plane.
Data Source
AI summary
A hermetically sealed module which comprises a central core housing including a perimeter side wall and a central core with opposed primary and secondary support surfaces. At least one coupling passageway is formed within the central core adjacent the perimeter side wall. The side wall has an sealed internal/external electrical connector which facilitates communication with the module. A multilayer substrate, with at least one flexible coupling tab, is supported by the primary support surface and at least one surface mounted component is supported by the secondary support surface. The flexible coupling tab passes through the at least one coupling passageway to facilitate coupling of a plurality of components of the multilayer substrate with a plurality of components of the at least one surface mounted component via a SMT connector. Primary and secondary lids are secured to opposed sides of the perimeter side wall and forming the hermetically sealed module.