Flexible Cup Cleaning Assembly for Unreachable Particle Removal
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Solution Overview
Problem
In semiconductor manufacturing, contaminant particles and materials adhere to the inner surfaces of cups and shrouds used in wet process apparatuses, particularly in unreachable areas, leading to reduced yield and cleanliness issues.
Innovation Solution
A contaminant particle removing assembly is introduced, featuring a flexible ejecting member with elongated tubes and a front tip, which uses pressurized cleaning material to reach and remove contaminants from unreachable areas of the cup, including an automatic cup-cleaning operation with rinsing and drying processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional cleaning methods are used, then the cleaning process is simple, but contaminants in unreachable areas of the cup cannot be removed
Solution Approach 1:
The cleaning assembly is divided into multiple elongated tubes arranged in an array, each capable of independently delivering cleaning material to different regions of the cup. This segmentation allows comprehensive coverage of unreachable areas while maintaining a modular structure that can be serviced by removing and replacing individual tubes.
Solution Approach 2:
The invention transitions from conventional single-point or linear cleaning approaches to a two-dimensional array of elongated tubes that can simultaneously clean multiple unreachable areas of the cup. This dimensional expansion enables comprehensive surface coverage without requiring complex mechanical movement.
2Manufacturing precision
If the cup is disassembled for cleaning, then all surfaces can be accessed, but production downtime increases
Solution Approach 1:
The elongated tubes are pre-positioned to extend into unreachable areas of the cup before the cup is installed in the semiconductor processing tool. This preliminary positioning allows cleaning to be performed on the installed cup without disassembly, eliminating downtime while ensuring all surfaces are accessible to the cleaning material.
Solution Approach 2:
The cleaning assembly is designed to service the cup while it remains in its installed position within the semiconductor processing tool. The system performs self-maintenance without requiring external disassembly or specialized cleaning equipment, allowing the cup to be cleaned in-situ during routine maintenance cycles.
3Manufacturing precision
If manual cleaning is performed, then flexibility is high, but cleaning consistency and thoroughness vary
Solution Approach 1:
The system incorporates sensors that detect the presence and amount of contaminant material on the cup surfaces. This feedback information is used to automatically adjust the cleaning process parameters, ensuring consistent and thorough cleaning results without requiring manual inspection or adjustment by operators.
Solution Approach 2:
The invention replaces manual mechanical cleaning operations with an automated system that delivers pressurized cleaning material through elongated tubes. This substitution eliminates variability associated with manual cleaning while reducing operational complexity through standardized automated processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively removes contaminant materials from previously unreachable areas, enhancing the cleanliness of semiconductor wafer manufacturing processes, reducing downtime, and improving maintenance efficiency.
Implementation Method 1
eject the pressurized cleaning material to remove the contaminant material from the unreachable area of the cup
Implementation Method 2
The pressurized cleaning material removes the contaminant material from the unreachable area of the cup
Implementation Method 3
The particle removing assembly includes a flexible ejecting member including a plurality of elongated tubes
Data Source
AI summary
An apparatus includes a wafer stage and a particle removing assembly. The wafer stage includes a cup adjacent to a wafer chuck. The particle removing assembly is configured to remove contaminant particles from the cup. In some embodiments, the particle removing assembly comprises a flexible ejecting member that includes one or more elongated tubes, a front tip, and a cleaning tip adapter configured to attach the front tip to each of the one or more elongated tubes. The front tip includes front openings and lateral openings from which pressurized cleaning material are introduced onto an unreachable area of the cup to remove the contaminant particles from the cup.