Flexible Electronic Device Layer Modulus Optimization
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Solution Overview
Problem
Foldable electronic devices face challenges in achieving desired deformation, service life, and reliability due to issues with the thickness and Young's modulus of their base and cover layers, which affect the display and touch sensing effects.
Innovation Solution
The flexible electronic device adjusts the thickness and Young's modulus of its base and cover layers to comply with specific expressions, such as E2/E1 ≤ 1.83 × (T2/T1) - 3.15, to improve the stress distribution and prevent crack formation when bent, thereby enhancing the device's reliability and service life.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the thickness and Young's modulus of the base layer and cover layer are not properly matched, then the device can achieve desired deformation, but the service life and reliability deteriorate due to stress concentration and crack formation
Solution Approach 1:
The patent applies parameter changes by establishing specific mathematical relationships between the thickness and Young's modulus of the base layer and cover layer. The formula E2/E1 ≤ 1.83 × (T2/T1) - 3.15 provides quantitative guidance for optimizing these parameters to balance flexibility and stress distribution, thereby improving both service life and reliability simultaneously.
Solution Approach 2:
The patent employs composite material principles by designing a multi-layer structure consisting of a base layer, electronic unit, and cover layer with different material properties. By carefully selecting and combining materials with appropriate thickness and Young's modulus values, the patent creates a composite structure that distributes stress effectively during bending, preventing crack formation while maintaining desired deformability.
2Adaptability or versatility
If the Young's modulus of the metal layer is less than 90,000 MPa, then the device achieves better flexibility, but the stress distribution becomes uneven causing crack formation
Solution Approach 1:
The patent applies local quality by differentiating the material properties at different locations and layers of the device. The metal layer with Young's modulus less than 90,000 MPa provides local flexibility, while the base layer and cover layer with specifically matched thickness and modulus values provide local stress distribution control. This spatial differentiation of material properties allows the device to achieve both flexibility and uniform stress distribution.
3Device complexity
If the thickness ratio and Young's modulus ratio of the base layer and cover layer are not optimized, then the device structure is simple, but the display effect and touch sensing effect deteriorate
Solution Approach 1:
The patent applies preliminary action by pre-establishing the optimal thickness and Young's modulus relationships between layers before the device is manufactured and assembled. The formula E2/E1 ≤ 1.83 × (T2/T1) - 3.15 provides advance guidance for selecting material parameters, ensuring that the display and touch sensing effects will be optimized before the actual device fabrication process begins, rather than requiring complex post-manufacturing adjustments.
Data Source
AI summary
A flexible electronic device is provided in this disclosure. The flexible electronic device includes a base layer, an electronic unit, and a cover layer. The electronic unit is disposed on the base layer, and the cover layer is disposed on the electronic unit. The base layer has a thickness T1 and a Young's modulus E1, and the cover layer has a thickness T2 and a Young's modulus E2, wherein the electronic unit includes a metal layer, the metal layer is a multi-layer, and when a Young's modulus of the metal layer is less than 90,000 MPa, the thickness T1, the thickness T2, the Young's modulus E1, and the Young's modulus E2 comply with following expression: E2/E1≤18.33×(T2/T1)−3.15.