Flexible Electronic Device Substrate Separation
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Solution Overview
Problem
Current methods for manufacturing flexible electronic devices, such as using sacrificial layers or organic release layers, face challenges like increased costs and damage to electronic components or non-uniform substrate thickness.
Innovation Solution
A method involving the formation of polyamic acid (PI) layers on a substrate with varying adhesion forces, allowing for easier separation of the electronic device layer from the substrate by cutting along a contour that matches or exceeds the boundary of the electronic device layer, utilizing a first PI layer with weaker adhesion in one area and a second PI layer with stronger adhesion in another area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a sacrificial layer is used to separate the flexible substrate from the glass substrate, then the separation process is enabled, but the manufacturing cost increases and electronic components may be damaged
Solution Approach 1:
The patent divides the adhesive layer into two distinct regions: a first region with strong adhesion force between the flexible substrate and glass substrate, and a second region with weak adhesion force that serves as a release region. This segmentation allows selective separation without damaging electronic components located in the first region.
Solution Approach 2:
The patent applies different adhesion characteristics to different regions of the same layer. The adhesive layer has locally varying adhesion forces, with the first region providing strong bonding for component protection and the second region providing weak bonding for easy separation, thus resolving the contradiction between reliable bonding and easy release.
2Ease of manufacture
If an organic release layer is disposed between the flexible substrate and glass substrate, then separation is enabled, but the release layer may form small islands causing holes and non-uniform thickness
Solution Approach 1:
The patent changes the adhesion parameter of the adhesive layer by creating regions with different adhesion forces. The weak adhesion region enables separation without requiring a separate release layer, while maintaining uniform thickness and avoiding the formation of small islands that would cause holes in the flexible substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables efficient and cost-effective separation of the electronic device layer from the substrate without damaging components, ensuring uniformity and reducing manufacturing costs.
Implementation Method 1
an adhesion force between the second layer and the substrate in the first area is weaker than that between the second layer and the first layer in the second area
Data Source
Figure 1A~1C
Figure 1D~1F
Figure 1G~2B
AI summary
A method for manufacturing a flexible electronic device includes forming a first layer on a substrate to define a first area and a second area surrounding the first area such that the substrate is exposed at least partially in the first area and the first layer is in the second area, forming a second layer on the first area and the first layer over the second area such that an adhesion force between the second layer and the substrate in the first area is weaker than that between the second and first layers in the second area, forming an electronic device layer (EDL) on the second layer over the first area, the EDL defining a boundary projectively within the first area, and separating the EDL from the substrate by cutting through the first and second layers along a contour within the first area but not less than the boundary.