Flexible Display Panel Adhesion Segmentation for Substrate Removal
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Solution Overview
Problem
Conventional methods for forming a thin-film-transistor (TFT) array on a flexible substrate face challenges due to the limited heat and chemical resistance of organic adhesive materials, leading to warping and breakage of the substrate during TFT array formation.
Innovation Solution
A method is developed where releasing-regions with lower bonding strength are formed on the flexible substrate, allowing for a stronger adhesive bond outside these regions, enabling easier separation of the flexible substrate from the rigid substrate without damaging the TFT array, using techniques such as plasma or corona surface treatment and hydrophobic/nano-coatings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a strong adhesive bond is used between the rigid substrate and flexible substrate, then adhesion strength is improved, but the flexible substrate cannot be removed after TFT array formation
Solution Approach 1:
The adhesive layer is segmented into different regions with different bonding strengths: a first adhesive region with strong bonding for substrate fixation, and a second adhesive region with weak bonding for easy removal. This segmentation allows the adhesive layer to provide both strong adhesion during manufacturing and easy detachment after TFT array formation, resolving the contradiction between adhesion strength and substrate removability.
2Temperature
If inorganic powder is doped into the organic adhesive material to enhance heat resistance, then thermal stability is improved, but adhesion strength decreases and substrate removal becomes difficult
Solution Approach 1:
The adhesive layer is designed with local quality variations: the first adhesive region contains inorganic powder for heat resistance and strong bonding, while the second adhesive region lacks inorganic powder for easy removal. This local differentiation allows the system to achieve both thermal stability during TFT fabrication and ease of substrate removal afterward, resolving the contradiction between heat resistance and adhesion strength.
3Ease of manufacture
If photo-sensitive adhesive materials are used to enable easy substrate removal, then substrate removability is improved, but the variety of available materials is limited
Solution Approach 1:
The adhesive layer uses a composite material system combining organic adhesive materials with and without inorganic powder doping. This composite approach provides versatility in material selection while achieving both strong adhesion in the first region and easy removal in the second region, overcoming the limitations of photo-sensitive adhesive materials and expanding material options.
4Manufacturing precision
If the organic adhesive material is exposed to high temperature during TFT array formation, then TFT fabrication is enabled, but the adhesive material undergoes out-gassing and decomposition causing substrate warping
Solution Approach 1:
The adhesive layer is segmented into a first adhesive region that can withstand high temperature (containing inorganic powder) and a second adhesive region that remains stable at lower temperatures. This segmentation allows TFT array formation to proceed at high temperatures without causing substrate warping, as the critical first adhesive region maintains structural integrity while the second region avoids thermal degradation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the yield of flexible display panel fabrication by preventing warping and breakage, ensuring the integrity of the TFT array during substrate separation and improving the overall manufacturing process.
Implementation Method 1
An adhesive layer is formed between the rigid substrate and the first surface of the flexible substrate
Implementation Method 2
using techniques such as plasma or corona surface treatment
Implementation Method 3
using techniques such as plasma or corona surface treatment
Implementation Method 4
using techniques such as plasma or corona surface treatment and hydrophobic/nano-coatings
Data Source
AI summary
In a method of fabricating a flexible display panel, a rigid substrate is provided. A flexible substrate having a first surface and a second surface opposite to the first surface is provided. A plurality of releasing-regions are formed on the first surface, and bonding strength of an area outside the releasing-regions is greater than bonding strength of the releasing-regions. An adhesive layer is formed between the rigid substrate and the first surface of the flexible substrate. A plurality of display units are formed on the second surface, and each of the display units is located over one of the releasing-regions, respectively. The flexible substrate is patterned to obtain a plurality of flexible carriers, and each of the flexible carriers carries one of the display units, respectively. The flexible carriers and the adhesive layer are de-bonded.