Flexible Display Panel Packaging with Segmented Adhesive Barrier Film
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Solution Overview
Problem
Existing flexible display panel packaging methods face challenges in efficiently separating adhesive portions and non-adhesive portions, leading to difficulties in automatic processing and potential issues with protective film bonding due to manual removal of adhesive layers.
Innovation Solution
A method involving a barrier film with an adhesive layer, where a non-adhesive portion covers the bonding area and an adhesive portion covers the display area, allowing for separation and mechanical stripping, and the use of light-sensitive adhesive layers for precise exposure, enabling efficient cutting and automatic packaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If manual removal of adhesive layers is used, then flexibility in handling is improved, but productivity and consistency deteriorate
Solution Approach 1:
The adhesive layer is segmented into different regions with different adhesive properties: a first adhesive region with strong adhesivity for bonding the protective film, and a second adhesive region with weak or no adhesivity for easy removal. This segmentation allows automated processing while maintaining operational flexibility.
Solution Approach 2:
Different regions of the adhesive layer are given different local qualities regarding adhesivity. The first adhesive region maintains strong bonding characteristics, while the second adhesive region is designed to lose adhesivity after treatment, enabling selective retention and removal based on spatial location.
2Strength
If adhesive layer is uniformly adhesive, then bonding strength is improved, but ease of separation deteriorates
Solution Approach 1:
The adhesive layer is divided into distinct functional zones: a first adhesive region that maintains strong bonding for the protective film, and a second adhesive region that is removed after bonding. This eliminates the need for uniform adhesivity across the entire layer.
Solution Approach 2:
The adhesive properties are changed spatially within the adhesive layer. The first adhesive region retains high adhesivity parameters, while the second adhesive region has reduced or zero adhesivity parameters, allowing selective bonding and removal based on location.
3Manufacturing precision
If light-sensitive adhesive is used, then precision in adhesive placement is improved, but process complexity increases
Solution Approach 1:
The mechanical or manual method of defining adhesive regions is replaced with a light-sensitive adhesive layer that uses optical exposure to selectively activate adhesivity. This substitution enables precise patterning through photomasking techniques.
Solution Approach 2:
The adhesive properties are controlled by changing the exposure parameter (light exposure) to different regions. The light-sensitive adhesive layer transitions from a non-adhesive state to an adhesive state in exposed regions, enabling precise spatial control of bonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the packaging process, reduces manual intervention, and improves the quality of protective film bonding by ensuring consistent adhesion, facilitating the production of flexible display devices like OLED displays.
Implementation Method 1
The adhesive layer is an adhesive layer sensitive to light; and before bonding the barrier film provided with the adhesive layer on the surface on a side of the display motherboard away from the substrate of the display motherboard, the method further comprises: forming the adhesive layer on the barrier film; and performing exposure on the adhesive layer via a mask, so that the non-adhesive portion in the adhesive layer is exposed and loses adhesivity and the adhesive portion in the adhesive layer is not exposed and keeps adhesivity.
Data Source
AI summary
A flexible display panel, a package method thereof and a display device are provided. The package method includes: bonding a barrier film provided with an adhesive layer on a surface of a side of a display motherboard away from a substrate of the display motherboard, the non-adhesive portion of the adhesive layer loses adhesivity and covers the bonding area; the adhesive portion at least covers the display area; cutting the display motherboard provided with the barrier film, so that the adhesive portion for covering the display area is separate from adjacent portions, and a portion to be retained and a portion to be removed in the barrier film are separate; and stripping off portions, except the adhesive portion for covering the display area, in the adhesive layer and the portion to be removed in the barrier film.