Bending-Resistant Connection Structure for Flexible Displays

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Solution Overview

Problem

Inorganic insulating materials are prone to breaking under external forces, affecting the conductive characteristics of attached conductive materials, making it challenging to create a bending-resistant connection structure for flexible displays and narrow frame displays.

Innovation Solution

A manufacturing method involving the formation of a first and second insulating layer with strategically formed openings, using a mask layer to create a step structure, which simplifies the process and reduces manufacturing costs, and includes a conductive layer and stress buffer layer to enhance flexibility and prevent material breakage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If inorganic insulating materials are used in the connection structure, then the structure provides good insulation properties, but the materials are prone to breaking under external forces during bending

Engineering Contradiction:

Improveinsulation propertiesVSAvoidresistance to breaking during bending

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The insulating layer is segmented into multiple parts: a first insulating layer and a second insulating layer, with the second layer having openings that expose portions of the first layer. This segmentation allows the structure to maintain insulation where needed while creating flexible zones that can accommodate bending stresses without breaking.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the insulating structure have different properties: areas with the second insulating layer provide good insulation, while areas with openings in the second layer expose the first layer to provide flexibility during bending. This local differentiation allows the structure to simultaneously achieve insulation and bend resistance.

Inventive Principle:

Principle #3Local quality

2Manufacturing precision

If traditional multi-step patterning processes are used to form openings in insulating layers, then the manufacturing precision can be maintained, but the device complexity and manufacturing cost increase

Engineering Contradiction:

Improveopening alignment precisionVSAvoidpatterning process complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patterning process is merged into a single step: the second opening and third opening are formed simultaneously in one patterning process. This combines multiple operations into one, reducing process complexity while maintaining the precision needed for proper alignment of the openings across different insulating layers.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The mask layer is formed in advance with a specific pattern that guides the subsequent single-step patterning process. This preliminary structuring allows the openings to be precisely positioned without requiring multiple alignment steps, simplifying the overall manufacturing process while maintaining precision.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method enables the creation of a bending-resistant connection structure that prevents conductive material breakage due to excessive segment differences, ensuring reliable electrical connections and flexibility during bending.

Implementation Method 1

etching the second insulating layer by using an etching mask formed on the second insulating layer as a mask; forming the third opening includes: etching the first insulating layer by using the etching mask and a portion of the mask layer exposed by the second opening as masks

Methodology Applied

Scientific EffectEtching:

Implementation Method 2

an etching rate of the material of the mask layer is smaller than an etching rate of the materials of the first insulating layer and the second insulating layer in a same dry etching process

Methodology Applied

Scientific EffectDifferential etching rate:

Implementation Method 3

sequentially forming the second opening and the third opening in the same dry etching process

Methodology Applied

Scientific EffectDry etching:

Implementation Method 4

a concentration of fluorine element in a gas atmosphere upon the third opening being formed is lower than a concentration of fluorine element in a gas atmosphere upon the second opening being formed

Methodology Applied

Scientific EffectPlasma etching:

Data Source

PatentUS11348952B2Connection structure and fabrication method thereof, array substrate and fabrication method thereof

Publication Date: 2022.05.31 CHENGDU BOE OPTOELECTRONICS TECH CO LTD

AI summary

Embodiments of the present provide a connection structure and a manufacturing thereof, an array substrate and a manufacturing method thereof, the manufacturing method of the connection structure includes: forming a first insulating layer on a base substrate forming a mask layer having a first opening on a side of the first insulating layer away from the base substrate; forming a second insulating layer op a side of the mask layer away-from the first insulating layer; forming a second opening exposing the first opening in the second insulating layer by one patterning process, and forming a third opening in the first insulating layer.