Flexible Display Bezel Bending Stress Reduction
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Solution Overview
Problem
Flexible display devices face issues with stress unevenness in the bending area due to uneven adhesive forces between the flexible PI substrate and the bottom film, leading to incomplete back bending of the circuit board and reduced display quality.
Innovation Solution
A manufacturing method that involves surface treating the bottom film to create varying adhesive forces between the bezel bending area and the remaining area, allowing for easy removal of the bottom film in the bending area, thereby reducing stress unevenness and enabling complete back bending of the circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the bottom film is uniformly adhered to the flexible PI substrate across the entire surface, then the structural integrity is maintained, but stress unevenness occurs in the bending area leading to incomplete back bending
Solution Approach 1:
The patent applies local quality by creating different adhesive force characteristics in different regions of the bottom film. The bezel bending area is treated to have reduced adhesive force compared to the remaining area, allowing the bending region to flex freely while maintaining structural integrity in non-bending regions. This regional differentiation resolves the contradiction between maintaining overall structural stability and enabling complete local bending.
2Stability of the object's composition
If the adhesive force between the bottom film and adhesive layer is uniform across the entire surface, then the lamination is stable, but the circuit board cannot achieve complete back bending due to stress constraints
Solution Approach 1:
The patent implements local quality by modifying the adhesive layer's properties in the bezel bending area versus the remaining area. The adhesive layer is configured to provide strong adhesion in non-bending regions for lamination stability, while having reduced adhesive force in the bending area to enable complete back bending of the circuit board without stress constraints.
3Shape
If the bottom film is removed completely from the bending area, then stress unevenness is reduced, but the adhesive layer may detach without sufficient support
Solution Approach 1:
The patent applies local quality by having the bottom film present in the remaining area to provide adhesive support and prevent detachment, while being removed from the bezel bending area to reduce stress unevenness. This spatial differentiation allows the adhesive layer to have sufficient support where needed while enabling free bending where required.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method decreases stress unevenness in the bending area, allowing for complete back bending of the COF and flexible printed circuit board, achieving a narrow bezel effect and improving display quality.
Implementation Method 1
surface treating the upper surface of the bottom film, such that an adhesive force between the bezel bending area and an adhesive layer to be laminated is less than an adhesive force between the remaining area and the adhesive layer to be laminated
Implementation Method 2
forming a first functional layer having hydrophilicity or hydrophobicity contrary to that of the adhesive layer to be laminated
Implementation Method 3
forming a first functional layer having hydrophilicity or hydrophobicity contrary to that of the adhesive layer to be laminated
Data Source
AI summary
The disclosure provides a method for manufacturing a flexible display device and a flexible display device. The manufacturing method comprises: providing a bottom film to be treated, the bottom film being divided into a bezel bending area and a remaining area; surface treating the upper surface of the bottom film, such that an adhesive force between the bezel bending area and an adhesive layer to be laminated is less than an adhesive force between the remaining area and the adhesive layer to be laminated; providing a display panel to be laminated, and adhering the display panel to the upper surface of the bottom film via the adhesive layer; removing a portion of the bottom film that is located within the bezel bending area.