Flexible Display Circuit Board Stacking for Lower Wire Density
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Solution Overview
Problem
The increased number of wires in flexible circuit boards due to multi-layer configurations leads to higher costs and lower defect-free ratios, particularly in display panels with touch functionality.
Innovation Solution
A display device design featuring a flexible circuit board with a first and second circuit board stacked differently, connected by conductive portions, reducing wire density and layer complexity through specific terminal connections and conductive pathways.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If wires are provided in many different layers of the flexible circuit board to reduce wire density, then wire density is reduced, but cost increases and defect-free ratio decreases
Solution Approach 1:
The patent transitions from planar wire routing to three-dimensional stacked circuit board architecture. Multiple circuit boards are stacked vertically with conductive portions extending between layers, enabling signal transmission in the vertical dimension. This reduces wire density in individual layers while maintaining connectivity without requiring excessive wire crossings in any single plane.
Solution Approach 2:
The flexible circuit board is divided into multiple separate circuit boards stacked together. Each circuit board contains a subset of the total wires, preventing all wires from existing in the same layer. This segmentation reduces wire density per layer and minimizes wire interference while maintaining all necessary connections through the stacked architecture.
2Quantity of substance
If wires are provided in many different layers of the flexible circuit board, then wire density is reduced, but manufacturing cost increases
Solution Approach 1:
By utilizing the vertical dimension through stacked circuit boards, the patent reduces the number of wire layers required in each individual board. This simplifies the manufacturing process for each layer while achieving the overall goal of reduced wire density, thereby lowering total manufacturing cost compared to creating many high-density layers.
Solution Approach 2:
Dividing the circuit board into multiple stacked segments allows each segment to be manufactured with fewer wires per layer, simplifying the manufacturing process for each individual board. The segmented approach reduces complexity and cost compared to manufacturing a single high-density multi-layer board.
Data Source
AI summary
A display device is provided. The display device includes a display panel (20) and a flexible circuit board electrically connected with the display panel (20). The flexible circuit board includes a first circuit board (11), a second circuit board (22) and a conductive portion; the first circuit board (11) includes a first substrate (100), and a main contact pad, a first wire (501) and a second wire (502) provided on the first substrate (100); the second circuit board (22) includes a second substrate (200), a relay contact pad and a third wire (210) provided on the second substrate (200); and the conductive portion is configured for electrically connecting the main contact pad and the relay contact pad.