Flexible Display Substrate Separation via Segmented Bonding
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Solution Overview
Problem
Conventional methods for manufacturing flexible display devices using a roll-to-roll or sheet-by-sheet process face challenges in separating a flexible substrate from a rigid substrate due to strong bonding, which can damage the display device when using laser release technologies, especially with transparent materials requiring precise laser control to avoid ablation and maintain transmittance.
Innovation Solution
A method involving the formation of bonding patterns on both flexible and rigid substrates, treated with ion beams and bonded under vacuum, followed by a cutting process to separate the flexible substrate with a display device, allowing for precise control and minimizing damage to the device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If laser release technology is used to separate the flexible substrate from the rigid substrate, then the bonding between substrates is overcome, but the display device may be damaged and the PI film transmittance decreases due to ablation and ashing
Solution Approach 1:
The bonding pattern is divided into discrete metal patterns on both substrates rather than continuous bonding. This segmentation allows the cutting process to separate substrates at specific locations while preserving the display area, avoiding laser-induced damage to the display device and maintaining PI film transmittance.
Solution Approach 2:
Metal bonding patterns serve as intermediary elements between the flexible substrate and rigid substrate. These patterns provide controlled bonding points that can be precisely cut, replacing the need for high-energy laser separation that causes ablation and transmittance loss.
2Ease of manufacture
If conventional coating and drying of PI solution on glass substrate is used, then the flexible substrate is formed, but strong bonding occurs making separation difficult and potentially damaging
Solution Approach 1:
The bonding interface is segmented into discrete metal patterns rather than continuous bonding. This allows the flexible substrate to be easily separated by cutting the metal patterns, avoiding the strong continuous bonding that causes separation difficulties and device damage in conventional methods.
Solution Approach 2:
Bonding is applied locally only at the metal bonding pattern locations rather than across the entire substrate surface. This localized bonding maintains ease of manufacture while enabling easy separation through cutting, resolving the contradiction between strong bonding and easy separation.
3Reliability
If high laser energy is used for separation, then the bonding is overcome, but the PI film is ablated and ashed reducing transmittance
Solution Approach 1:
Metal bonding patterns act as intermediary elements that can be precisely cut to separate substrates. This replaces high-energy laser ablation with a controlled cutting process, ensuring effective separation while preserving PI film transmittance without ablation or ashing.
Solution Approach 2:
The laser-based thermal separation mechanism is replaced with a mechanical or precision cutting process for removing bonding patterns. This substitution eliminates the ablation and ashing problems associated with high-energy laser while maintaining effective separation capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively separates the flexible substrate from the rigid substrate without damaging the display device, maintaining the transmittance of the PI film and enabling the production of flexible display devices with improved manufacturing efficiency.
Implementation Method 1
prior to forming the first bonding pattern on the flexible substrate, at least a surface portion of the flexible substrate is treated by an ion beam. The treated surface portion is prepared for forming the first bonding pattern.
Implementation Method 2
The first and second bonding patterns are bonded together to provide a bonding pattern between the flexible substrate and the rigid substrate. Optionally, the step of bonding the first and second bonding patterns together includes pressing the first substrate against the rigid substrate under vacuum.
Implementation Method 3
The bonding pattern is removed by a cutting process performed so as to separate the flexible substrate having the display device thereon from the rigid substrate.
Data Source
AI summary
Methods for manufacturing a flexible display device are provided. A flexible substrate is provided and a first bonding pattern, which encloses a display area, is formed on the flexible substrate. A second bonding pattern is formed on a rigid substrate. The first and second bonding patterns are bonded together to provide a bonding pattern between the flexible substrate and the rigid substrate. At least one display device is formed on the display area of the flexible substrate. The bonding pattern is removed by a cutting process performed so as to separate the flexible substrate having the display device thereon from the rigid substrate.