Flexible Display Substrate Bonding Regions Reduce Deformation
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Solution Overview
Problem
Flexible display substrates deform during bonding with driver chips, leading to defects such as broken signal traces and short circuits due to excessive deformation and inadequate bonding, which affects the screen-to-body ratio and overall display device performance.
Innovation Solution
A flexible display substrate with distinct first and second bonding regions, where the first region is for signal transmission and the second region is not, with varying thickness and layer configurations to reduce deformation by providing support and increasing contact area during bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If the flexible display substrate is made thin to achieve light weight and flexibility, then the flexibility and light weight are improved, but the substrate deforms excessively during bonding leading to broken signal traces and short circuits
Solution Approach 1:
The patent applies local quality by creating a thick film layer structure specifically in the bonding region while keeping other regions thinner. The thick film layer (comprising multiple sub-layers totaling 5-20 μm) is localized at the bonding area where the driver IC is mounted, providing enhanced mechanical support and deformation resistance only where needed, without compromising the overall flexibility and light weight of the display substrate.
2Length of stationary object
If the flexible display substrate is made thin to achieve thinness, then the thinness is improved, but the substrate deforms excessively during bonding leading to inadequate bonding and defects
Solution Approach 1:
The patent implements local quality by concentrating the thick film layer structure (5-20 μm total thickness) specifically in the bonding region, while other regions of the substrate remain thinner. This localized thickening provides the necessary mechanical rigidity and deformation resistance during the bonding process to ensure precise alignment and adequate bonding, without increasing the overall thickness of the display substrate.
Solution Approach 2:
The patent applies dimensionality change by adding thickness in the vertical dimension (z-direction) at the bonding region through multiple film layers, while maintaining thinness in the horizontal dimensions. The thick film layer structure comprises signal transmission layers, protective layers, and buffer layers stacked vertically, providing enhanced mechanical support in the thickness direction without expanding the substrate's planar footprint.
3Strength
If the flexible display substrate is made thin to achieve good impact resistance, then the impact resistance is improved, but the substrate deforms excessively during bonding causing broken signal traces and short circuits
Solution Approach 1:
The patent applies local quality by creating a thick film layer structure (5-20 μm) specifically in the bonding region where the driver IC is mounted, while keeping other regions thinner to maintain flexibility and impact resistance. The thick film layer includes signal transmission layers, protective layers, and buffer layers that provide localized mechanical support and deformation resistance, preventing excessive deformation during bonding that would cause broken signal traces or short circuits.
Data Source
AI summary
Provided are a flexible display substrate, a display panel, a display device, and a manufacturing method, relating to the technical field of display. The flexible display substrate is provided with a first bonding and a second bonding region. The first bonding region and the second bonding region are configured to be bonded to an electronic component, and a thickness of the flexible display substrate in the first bonding region is greater than a thickness of the flexible display substrate in the second bonding region in a direction perpendicular to the flexible display substrate.