Flexible Display Panel Bonding via Strip Slits

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Solution Overview

Problem

The manufacturing of flexible display panels faces challenges due to non-uniform expansion of the flexible substrate during the attachment of a back film, leading to misalignment and disconnection of circuits between the flexible substrate and chip, particularly exacerbated by the large size of the panels required for in-vehicle and foldable devices.

Innovation Solution

A method involving the creation of a strip slit or hollowed region between adjacent flexible chip bonding regions on the flexible substrate, which separates and spaces these regions, preventing uneven expansion and allowing for accurate alignment during the bonding process with a printed circuit, and includes a laser lift-off process for separating the flexible substrate from a rigid substrate before attaching the back film.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If a large-size flexible substrate is used for in-vehicle and foldable devices, then the display area and functionality are improved, but non-uniform expansion occurs during back film attachment causing misalignment and circuit disconnection

Engineering Contradiction:
Improvedisplay areaVSAvoidalignment precision
Core Design Contradiction:
Area of stationary objectVSManufacturing precision

Solution Approach 1:

The bonding region is divided into multiple independent flexible chip bonding regions (first, second, third bonding regions) with through holes or strip slits between them. This segmentation prevents stress propagation across the entire substrate, allowing each bonding region to maintain dimensional stability independently during back film attachment, thereby preventing misalignment and circuit disconnection in large-size displays.

Inventive Principle:
Principle #1Segmentation

2Productivity

If the flexible substrate size is increased to meet demand, then productivity and application scope are improved, but the risk of pad misalignment and circuit disconnection increases

Engineering Contradiction:
Improveproduction yieldVSAvoidcircuit connection reliability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

Through holes or strip slits are pre-formed in the bonding region before attaching the back film. This preliminary action creates predetermined stress relief pathways that prevent non-uniform expansion during subsequent processing steps, ensuring that pad alignment and circuit connections remain reliable even as substrate size increases for higher productivity applications.

Inventive Principle:
Principle #10Preliminary action

3Device complexity

If a continuous bonding region is used, then manufacturing process is simplified, but stress accumulation causes non-uniform expansion and bonding failures

Engineering Contradiction:
Improvestructure complexityVSAvoidbonding precision
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The bonding region is designed with locally differentiated properties: solid bonding areas for electrical connection and through holes or strip slits for stress relief. This local quality differentiation allows the structure to maintain bonding precision by preventing stress accumulation at critical bonding interfaces, while keeping the overall manufacturing process relatively simple.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach ensures accurate alignment and bonding of flexible chips with printed circuits, enhancing the production yield by preventing stress accumulation and non-uniform expansion, thus addressing the issue of low yield caused by size inconsistencies in flexible substrates.

Implementation Method 1

separating the rigid substrate and the flexible substrate by a laser lift-off process

Methodology Applied
Scientific EffectLaser: Laser

Data Source

PatentUS10873042B2Flexible display panel and method of manufacturing the same
Publication Date: 2020.12.22 BEIJING BOE TECH DEV CO LTD
  • US10873042B2 patent drawing
  • US10873042B2 patent drawing
  • US10873042B2 patent drawing

AI summary

The present disclosure provides a flexible display panel and a method of manufacturing the same. The method includes: manufacturing a flexible substrate; performing a cutting at a position between at least two adjacent flexible chip bonding regions to form a strip slit or hollowed region to structurally separate and space the at least two adjacent flexible chip bonding regions; attaching a backing film and cutting away a portion of the back film at the position corresponding to the strip slit or hollowed region; and bonding a flexible chip with a printed circuit on the flexible chip. Embodiments of the present disclosure also provide a flexible display panel.