Flexible Display Panel Buffer Holes for Wire Stress Relief

The patent applies beforehand cushioning by introducing a buffer layer in the bending area before the bending process. This buffer layer absorbs and distributes the stress that occurs during bending, preventing wire damage while enabling the frame size reduction. The buffer layer is specifically positioned in the bending area to provide protective cushioning exactly where the stress concentration occurs during the bending operation.

The patent applies the intermediary principle by introducing a buffer layer as a mediator between the wires and the bending stress. This buffer layer acts as an intermediate substance that absorbs the mechanical stress during bending, allowing the connection to be formed while protecting the wires from direct stress exposure. The buffer layer mediates the interaction between the bending force and the wire structure.

The patent applies the porous materials principle by creating buffer holes within the bending portion of the flexible substrate. These holes reduce the overall density and rigidity of the substrate in the bending area, allowing it to flex more easily while maintaining structural integrity. The porous structure formed by the buffer holes enables stress reduction during bending while adding minimal complexity to the overall device structure.