Flexible Display Capacitor Layout for Repeated Bending Durability
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Solution Overview
Problem
Current display devices using flexible substrates lack the necessary flexibility, reliability, and durability to withstand repeated bending operations without breaking, and there is a need for a manufacturing method that can produce lightweight, non-breakable, and easily bendable display devices with improved performance.
Innovation Solution
A display device is designed with a flexible substrate that includes a light-transmitting semiconductor film, a capacitor with a specific electrode and dielectric film configuration, and an insulating film, allowing for a top-emission, bottom-emission, or dual-emission structure. The device features a transistor and light-emitting element capable of emitting white light, with a coloring layer optionally overlapping the light-emitting element, and uses a bonding layer to attach substrates with a protective film to enhance durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a flexible substrate is used in display devices, then flexibility and ease of bending are improved, but reliability and durability during repeated bending operations deteriorate
Solution Approach 1:
The patent employs flexible substrates including plastic substrates and thin film structures throughout the display device construction. The encapsulation layer, semiconductor layer, and various functional layers are all designed as flexible thin films that maintain structural integrity during bending operations, enabling the device to achieve both flexibility and durability
Solution Approach 2:
The patent uses composite material structures combining multiple layers with different properties - such as the encapsulation layer combining barrier properties with flexibility, and the semiconductor layer combining electrical functionality with mechanical flexibility. These composite structures maintain reliability while enabling repeated bending
2Ease of manufacture
If traditional manufacturing methods are used, then manufacturing process simplicity is maintained, but the ability to produce lightweight and highly flexible devices deteriorates
Solution Approach 1:
The patent extracts the semiconductor element from traditional rigid substrates and transfers it to flexible substrates. This extraction allows the removal of heavy glass or quartz substrates while maintaining the semiconductor functionality, resulting in lightweight devices that can be manufactured using adapted conventional processes
Solution Approach 2:
The patent changes the substrate material parameters from rigid glass/quartz to flexible plastics and thin films. This parameter change enables weight reduction and enhanced flexibility while maintaining compatibility with manufacturing processes through careful selection of flexible substrate materials and deposition conditions
3Reliability
If the insulating film covers the entire semiconductor film region, then complete protection is achieved, but the capacitor electrode-dielectric contact region is compromised
Solution Approach 1:
The patent applies local quality by making the insulating film coverage selective rather than uniform. The insulating film is positioned to cover specific regions of the semiconductor film while deliberately leaving the capacitor electrode-dielectric contact region exposed, providing localized protection where needed while maintaining capacitor functionality
Solution Approach 2:
The patent segments the insulating film coverage into distinct regions - covered areas for protection and uncovered areas for capacitor operation. This segmentation allows the device to simultaneously achieve complete protection where required and proper capacitor electrode-dielectric contact where needed, managing complexity through spatial division
Data Source
AI summary
A highly flexible display device and a method for manufacturing the display device are provided. A transistor including a light-transmitting semiconductor film, a capacitor including a first electrode, a second electrode, and a dielectric film between the first electrode and the second electrode, and a first insulating film covering the semiconductor film are formed over a flexible substrate. The capacitor includes a region where the first electrode and the dielectric film are in contact with each other, and the first insulating film does not cover the region.