Flexible Integrated Display Module Merging COF and Touch Circuits
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Solution Overview
Problem
Current flexible foldable display modules face challenges in quality control, cost, structural complexity, and yield due to the need for multiple bonding processes and potential damage during the manufacturing of foldable or rollable products, particularly with the integration of COF, display FPC, and DOT-TP-FPC components.
Innovation Solution
The integration of COF, display FPC, and DOT-TP-FPC on a flexible display substrate with defined functional areas, eliminating the need for bonding processes and incorporating touch control display driving integrated circuit chips for signal generation, thereby simplifying the structure and reducing manufacturing steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If COF, display FPC, and DOT-TP-FPC are produced by external partners and bonded together through multiple bonding processes, then the display module can be assembled with separate components, but the quality control becomes difficult, cost increases, and manufacturing yield declines
Solution Approach 1:
The patent integrates COF, display FPC, and DOT-TP-FPC into a single integrated substrate structure. The circuit patterns for all three components are formed on the same flexible substrate through a unified manufacturing process, eliminating the need for separate production and bonding of multiple components. This merging approach ensures consistent quality control across all functional elements while reducing assembly complexity and manufacturing cost.
2Ease of manufacture
If multiple bonding processes are used to assemble COF, display FPC, and DOT-TP-FPC, then the display module can be constructed with functional separation, but the manufacturing process becomes complex and prone to defects such as laminate offset and particle contamination
Solution Approach 1:
The patent combines the manufacturing of COF, display FPC, and DOT-TP-FPC into a single integrated process. All circuit patterns are formed on the same flexible substrate using sequential photolithography and etching steps, eliminating the need for multiple bonding processes. This approach simplifies the manufacturing process while maintaining functional separation through distinct circuit region definitions on the integrated substrate.
3Adaptability or versatility
If bonding processes are used to connect flexible printed circuit boards with IC components, then the display module can be assembled with external driving systems, but the IC and connecting channels are easily damaged during folding or rolling operations
Solution Approach 1:
The patent integrates the external driving system connection directly onto the flexible substrate without using separate IC components or bonding processes. The driving circuit patterns are formed directly on the flexible substrate, creating a monolithic structure that maintains flexibility and resistance to damage during folding or rolling operations. This eliminates the rigid IC components and bonding interfaces that are susceptible to damage.
4Ease of manufacture
If separate components are bonded together to form the flexible display module, then the module can be manufactured with modular architecture, but the overall yield declines and manufacturing cost increases
Solution Approach 1:
The patent merges the manufacturing of all display components into a single integrated process on one flexible substrate. This eliminates the cumulative yield loss that occurs when multiple separate components are manufactured and then bonded together. The integrated approach ensures that all functional elements are created in a unified manufacturing process, maximizing overall yield while reducing the complexity of modular assembly.
Data Source
AI summary
The present invention discloses a flexible integrated display panel module and manufacturing method thereof, the flexible integrated display panel module includes a flexible integrated display substrate, which including an integrated area, an active area and a non-display disposed at one side of the integrated area, the integrated area divided into a plurality of areas, used to defined as a corresponding functional area. The functional area includes: a display wiring functional area and a plurality of direct on-cell touch control wiring functional areas disposed on both sides of the display functional area.