Flexible Display Substrate Openings for Low-Resistance Contacts
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Solution Overview
Problem
Existing flexible display devices face challenges in forming elements on flexible substrates, leading to difficulties in improving the characteristics of these elements.
Innovation Solution
A display device is designed with a substrate having an opening, a buffer layer, a semiconductor, a gate electrode, source and drain electrodes, and a light-emitting device. The semiconductor includes a channel region and contact regions, with the substrate opening overlapping these contact regions, allowing for improved electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If elements are formed on a flexible substrate, then the display device achieves flexibility, but the characteristics of the elements cannot be improved due to difficulties in formation processes
Solution Approach 1:
The patent divides the substrate into multiple regions: a flexible substrate portion and a rigid supporting substrate portion. The opening is formed specifically in the flexible substrate portion, allowing laser beams to pass through to the semiconductor layer without affecting the overall flexibility of the display device. This segmentation enables selective treatment of different substrate regions to resolve the contradiction between flexibility and element formation quality.
Solution Approach 2:
The patent applies local quality by creating an opening only in specific regions of the substrate where contact regions are located, while maintaining the intact structure in other areas. This localized modification allows improved electrical connection at contact regions without compromising the flexibility of the overall device, as the opening is strategically placed only where needed for element characteristic improvement.
2Shape
If the substrate is made flexible, then the display device can be folded or bent, but it becomes difficult to form elements with good electrical connections
Solution Approach 1:
The patent performs preliminary action by forming the opening in the substrate before forming the semiconductor layer and electrodes. This allows the semiconductor and electrode materials to be deposited directly over the opening region, ensuring good electrical connection at the contact regions while maintaining the flexible substrate's ability to be folded or bent. The preliminary opening formation resolves the manufacturing difficulty by preparing the structure in advance.
Solution Approach 2:
The opening in the substrate acts as an intermediary structure that facilitates better electrical connection between the semiconductor layer and electrode layers. By creating this localized absence of substrate material, the patent enables direct contact and improved electrical pathways without requiring changes to the flexible nature of the substrate itself.
3Reliability
If openings are formed in the substrate to improve electrical connections, then element characteristics improve, but the substrate structure becomes more complex
Solution Approach 1:
The patent applies the taking out principle by removing substrate material only in the specific regions where openings are needed, rather than modifying the entire substrate structure. This selective extraction creates simple circular or rectangular openings that improve electrical connections at contact regions while adding minimal complexity to the overall substrate structure. The simplicity of this approach resolves the contradiction between improved electrical connections and structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution enhances the characteristics of elements in flexible display devices by improving electrical connections and reducing resistance, leading to better performance and functionality.
Implementation Method 1
The buffer layer may include a first region and a second region disposed at respective sides of the semiconductor in a plan view, and may fill the opening of the substrate. The source electrode may electrically contact a lower surface of the first region, and the drain electrode may electrically contact a lower surface of the second region.
Data Source
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AI summary
A display device and a method for manufacturing the same are provided. The display device includes a substrate including an opening, a buffer layer disposed on the substrate, a semiconductor disposed on the buffer layer, a gate electrode overlapping at least a portion of the semiconductor in a plan view, a source electrode and a drain electrode electrically connected to the semiconductor, and a light-emitting device electrically connected to the drain electrode. The opening of the substrate overlaps another portion of the semiconductor in a plan view.