Flexible Display Motherboard Dissolvable Layer Separation
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Solution Overview
Problem
Conventional methods for separating a flexible base from a carrier substrate in flexible display panel manufacturing, such as mechanical peeling and laser separation, result in damage to the flexible base and performance degradation of thin film transistors due to heat-induced carbonization and irradiation effects.
Innovation Solution
A flexible display motherboard with a dissolvable layer between the carrier substrate and the flexible base, which can be dissolved by a solvent, allowing for separation without mechanical peeling or laser irradiation, thereby minimizing damage to the flexible base and maintaining the performance of the display device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If mechanical separation is used to separate the flexible base from the carrier substrate, then the separation process is simple, but it causes a great quantity of micro-particles, incomplete peeling and serious damage to the flexible base
Solution Approach 1:
The patent introduces a release layer as an intermediary between the flexible base and the carrier substrate. This release layer enables clean separation by providing a dedicated interface that peels away from the flexible base without damaging it, while allowing the flexible base to be completely separated from the carrier substrate without leaving micro-particles or causing incomplete peeling.
2Manufacturing precision
If laser separation is used to separate the flexible base from the carrier substrate, then micro-particles are reduced and process precision is improved, but high heat causes carbonization in the irradiated region affecting substrate transmittance and laser irradiation penetrates the substrate causing thin film transistor threshold voltage drift
Solution Approach 1:
The release layer serves as a mediator that absorbs the separation energy, allowing the flexible base to be separated from the carrier substrate without direct laser irradiation of the flexible base itself. The laser irradiates the release layer which then peels away, taking the separation energy with it and preventing heat-induced carbonization and threshold voltage drift in the thin film transistors.
Solution Approach 2:
The patent replaces direct mechanical or laser-based separation of the flexible base from the carrier substrate with a chemical/biological dissolution process. The release layer is designed to be soluble in specific solvents, allowing the flexible base to be separated by dissolving the release layer rather than by mechanical peeling or laser ablation, thereby avoiding heat and mechanical damage entirely.
3Reliability
If a dissolvable layer is added between the carrier substrate and the flexible base, then damage to the flexible base is mitigated, but the device structure becomes more complex
Solution Approach 1:
The release layer is designed as a temporary, disposable component that serves its purpose during the manufacturing and separation process, then is completely dissolved and removed. This temporary layer protects the flexible base during separation but does not become part of the final product, thereby minimizing the impact on the final device structure and complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively separates the flexible display panel from the carrier substrate without causing damage to the flexible base, ensuring the integrity and performance of the thin film transistors and reducing defects like micro-particles and incomplete peeling.
Implementation Method 1
the dissolvable layer is dissolved by a solvent
Data Source
AI summary
A flexible display motherboard and a manufacturing method thereof are provided. The flexible display motherboard includes a carrier substrate and a flexible display panel unit formed thereon. The flexible display panel unit includes a flexible base formed on the carrier substrate, and a display region and a periphery region which are positioned on the flexible base. A display device is formed in the display region, and the periphery region surrounds the display region. The flexible display panel unit further includes a dissolvable layer positioned between the carrier substrate and the flexible base. The dissolvable layer is formed at least in an area corresponding to the display region. The dissolvable layer is dissolvable in a solvent.