Flexible Display Driver Chip Heat Dissipation via Recessed Nesting

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Solution Overview

Problem

The heat dissipation of driver chips in flexible display screens is inadequate, leading to display abnormalities such as yellowish and dark spots, especially in high-temperature environments, due to heat accumulation affecting the encapsulated layer.

Innovation Solution

A flexible display screen design incorporating a recess on the support portion to house the driver chip, with a sequential arrangement of a first heat insulation layer, a heat dissipation layer, and a second heat insulation layer in the display region, effectively dissipating heat generated by the driver chip.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If the driver chip is placed on the back of the encapsulated layer in the COF design, then the full-screen display effect is achieved, but heat accumulates and causes display abnormalities such as yellowish and dark spots

Engineering Contradiction:

Improvedisplay effectVSAvoidheat accumulation

Core Design Contradiction:

Illumination intensityVSTemperature

Solution Approach 1:

The patent introduces a heat dissipation layer as an intermediary component between the driver chip and the encapsulated layer. This heat dissipation layer acts as a mediator to transfer heat away from the driver chip, preventing heat accumulation that would otherwise cause display abnormalities while maintaining the full-screen display effect achieved through the COF design.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent segments the heat management function by separating the heat dissipation function from the structural support function. The heat dissipation layer is divided into multiple sub-layers with different materials and functions, allowing independent optimization of heat dissipation performance without affecting the overall COF structure and display quality.

Inventive Principle:

Principle #1Segmentation

2Device complexity

If the driver chip is received directly without heat dissipation treatment, then the device structure is simple, but heat diffuses to the display region affecting display quality

Engineering Contradiction:

ImprovestructureVSAvoiddisplay quality

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

The patent implements a nested structure where the driver chip is received within a recess of the support portion, and the heat dissipation layer is positioned between the driver chip and the encapsulated layer. This nesting arrangement integrates heat dissipation functionality within the existing COF structure without significantly increasing device complexity, while effectively preventing heat diffusion to the display region and maintaining display quality.

Inventive Principle:

Principle #7Nested doll (Nesting)

3Temperature

If heat dissipation layers are added between the driver chip and encapsulated layer, then heat dissipation is improved, but the device structure becomes more complex

Engineering Contradiction:

Improveheat dissipationVSAvoidstructure

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent applies local quality by positioning the heat dissipation layer specifically in the region where heat accumulation occurs (between the driver chip and the encapsulated layer), rather than uniformly throughout the entire device. The heat dissipation layer includes multiple sub-layers with different materials optimized for specific functions, allowing effective heat dissipation while minimizing the increase in overall device complexity.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances heat dissipation, reducing the impact of heat on the display region and maintaining a good display effect even in high-temperature environments, thereby improving the reliability of the flexible display screen.

Implementation Method 1

by sequentially arranging the first heat insulation layer, the heat dissipation layer, and the second heat insulation layer in the display region of the flexible display panel, the heat generated by the driver chip in use can be effectively dissipated

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a first heat insulation layer, a heat dissipation layer, and a second heat insulation layer which are stacked in the display region and along a direction from the back to a light-emitting surface

Methodology Applied

Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentUS11882679B2Flexible display screen and flexible display apparatus

Publication Date: 2024.01.23 KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD

AI summary

Disclosed are a flexible display screen and a flexible display device. The flexible display screen includes a flexible display panel and a driver chip, the flexible display panel includes a support portion, a first heat insulation layer, a heat dissipation layer, and a second heat insulation layer which are arranged in sequence along a direction from back to a light-emitting surface, the support portion is provided with a recess, and the driver chip is received in the recess.