Flexible Display Electrode Exposure via Peeling Layer
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Solution Overview
Problem
The existing methods for manufacturing display devices with flexible substrates often damage electrodes and reduce the reliability and yield of the manufacturing process, leading to signal attenuation and increased wiring resistance due to the need to expose electrodes for external connections.
Innovation Solution
A method involving a series of substrate attachment and peeling steps with specific organic films and insulating layers, using light irradiation and heat treatment, to create openings and expose electrodes without damaging the display region or electrode, ensuring high visibility, reliability, and low power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If part of the flexible substrate is removed by laser light or with an edged tool to expose the electrode, then the electrode can be connected to external electrodes, but the electrode is easily damaged and the reliability and manufacturing yield are reduced
Solution Approach 1:
The patent introduces a peeling layer as an intermediary between the flexible substrate and the electrode. This peeling layer has weak adhesion to both the substrate and the electrode, allowing the substrate to be peeled away to expose the electrode for connection while preventing direct damage to the electrode during the peeling process. The peeling layer acts as a buffer that absorbs the mechanical stress of substrate removal.
2Ease of operation
If part of the flexible substrate is removed by laser light or with an edged tool, then the electrode can be exposed for connection, but the display region may be damaged and manufacturing yield is reduced
Solution Approach 1:
The peeling layer serves as a protective intermediary that covers the display region during substrate peeling. Since the peeling layer is designed to peel away with the substrate while leaving the electrode intact, it prevents the substrate removal process from directly contacting and damaging the display region, thereby maintaining manufacturing precision.
3Reliability
If sufficient space is provided between the display region and the electrode to prevent damage, then the display region is protected, but signal attenuation or electric power attenuation occurs due to increased wiring resistance
Solution Approach 1:
The peeling layer automatically provides protective coverage to the display region during the substrate peeling process. By designing the peeling layer with appropriate adhesion characteristics, it self-adjusts to cover the display region when the substrate is peeled away, eliminating the need for additional protective structures or excessive spacing between the display region and electrode.
4Adaptability or versatility
If a flexible substrate is used for the display device, then the device can have flexibility and be thin and lightweight, but the electrode must be exposed for connection which complicates the manufacturing process
Solution Approach 1:
The peeling layer is a simple intermediary structure that enables the flexible substrate to be peeled away cleanly to expose the electrode for connection. This single-layer solution simplifies the manufacturing process compared to more complex methods that might require multiple processing steps, specialized equipment, or additional protective structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively prevents electrode damage, enhances manufacturing reliability, and reduces power consumption by optimizing the structure and connection of display devices with flexible substrates, resulting in improved display quality and reduced manufacturing costs.
Implementation Method 1
attaching the first substrate to the second substrate with a bonding layer provided therebetween
Implementation Method 2
part of the first organic film and part of the second organic film are peeled together with the second substrate to expose at least part of the electrode
Implementation Method 3
using light irradiation and heat treatment, to create openings and expose electrodes without damaging the display region or electrode
Data Source
AI summary
A method for manufacturing a display device is provided. The method includes a step of forming a first layer over a first substrate, a terminal electrode over the first layer, a display element over the first layer, and a peeling layer overlapping with the terminal electrode, a step of forming a second layer over a second substrate, a step of attaching the first substrate to the second substrate with a bonding layer therebetween, a step of separating the first substrate from the first layer, a step of attaching a third substrate to the first layer, a step of separating the second substrate from the second layer together with part of the bonding layer, and a step of attaching a fourth substrate to the second layer. At least one of the first layer and the second layer includes an organic film.