Flexible Display Substrate Adhesion via Exposed Fiber Bundles

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Solution Overview

Problem

Flexible display apparatuses face issues with substrate separation due to weak adhesive forces between substrates, particularly when subjected to external forces or bending, leading to fractures at the interface between coating layers and resin.

Innovation Solution

The implementation of a display apparatus with fiber bundles and a base material impregnated between them, where an adhesive part is applied to exposed fiber bundles, enhancing the adhesive force by forming a recess in the substrate and using a sealant that adheres directly to the fiber bundles, thereby increasing the effective bonding area.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a conventional substrate structure with coating layers and resin is used, then the manufacturing process is simple, but the adhesive force between substrates is weak causing separation under external forces

Engineering Contradiction:
Improveadhesive forceVSAvoidsubstrate structure
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The patent applies preliminary action by pre-forming recesses in the substrate before applying the adhesive part. These recesses are created in advance to expose fiber bundles, which then provide enhanced anchoring for the adhesive. This preliminary structural preparation ensures that when substrates are assembled, the adhesive immediately benefits from the mechanical interlocking capability provided by the exposed fibers, preventing separation under external forces without requiring complex assembly processes.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent employs composite materials by combining fiber bundles (such as glass fibers) with a base material to create a hybrid substrate structure. The fiber bundles provide tensile strength and mechanical interlocking, while the base material provides structural continuity and adhesion. This composite approach significantly enhances the adhesive force between substrates compared to conventional homogeneous materials, as the adhesive can mechanically interlock with both the fiber surfaces and the base material.

Inventive Principle:
Principle #40Composite materials

2Strength

If the adhesive part is applied to a flat substrate surface, then the application process is simple, but the bonding area is limited reducing adhesive strength

Engineering Contradiction:
Improvebonding strengthVSAvoidsubstrate processing
Core Design Contradiction:
StrengthVSEase of manufacture

Solution Approach 1:

The patent applies segmentation by dividing the substrate surface into multiple regions through the formation of recesses. These recesses create distinct zones where fiber bundles are exposed, effectively segmenting the otherwise flat surface. This segmentation increases the total surface area available for adhesive bonding and creates multiple anchoring points, thereby enhancing the overall bonding strength without requiring excessively complex manufacturing processes.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from a two-dimensional flat substrate surface to a three-dimensional structured surface with recesses and exposed fiber bundles. This dimensional change creates additional bonding interfaces and increases the effective surface area for adhesive attachment. The vertical depth of the recesses adds a third dimension to the bonding interface, allowing the adhesive to mechanically interlock rather than merely adhering to a flat plane, thereby significantly improving bonding strength.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Strength

If fiber bundles are fully embedded in base material, then the substrate structure is uniform, but the adhesive cannot achieve strong mechanical interlocking

Engineering Contradiction:
Improvemechanical interlockingVSAvoidsubstrate uniformity
Core Design Contradiction:
StrengthVSStability of the object's composition

Solution Approach 1:

The patent applies local quality by creating regions of different structural characteristics within the substrate. Specifically, recesses are formed in certain areas to expose fiber bundles, while other areas maintain the conventional embedded fiber structure. This localized modification allows the adhesive to achieve strong mechanical interlocking at the recess sites where fibers are exposed, while the rest of the substrate maintains its structural uniformity and integrity. The different regions serve different functions: exposed fibers for bonding, embedded fibers for structural stability.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration significantly improves the adhesive force between substrates, effectively preventing or reducing separation, as demonstrated by increased resistance to external loads and improved bonding strength.

Implementation Method 1

The adhesive part contacts the exposure area... adheres the first substrate to the second substrate

Methodology Applied
Scientific EffectAdhesion: Adhesive

Implementation Method 2

a base material which is impregnated between the fiber bundles

Methodology Applied
Scientific EffectAbsorption: Absorption (physical)

Data Source

PatentUS9245463B2Display apparatus and method of manufacturing the same
Publication Date: 2016.01.26 SAMSUNG DISPLAY CO LTD
  • US9245463B2 patent drawing
  • US9245463B2 patent drawing
  • US9245463B2 patent drawing

AI summary

A display apparatus includes a first substrate, a second substrate, a pixel layer and an adhesive part. The first substrate includes an adhesive area, fiber bundles and a base material which is impregnated between the fiber bundles. The second substrate includes an adhesive area, fiber bundles and a base material which is impregnated between the fiber bundles. The pixel layer is between the first and second substrates and includes a display area. The adhesive part is between the first substrate and the second substrate, is in each of the adhesive areas of the first and second substrates, and seals the pixel layer between the first and second substrates. The adhesive area of the first or second substrate includes an exposure area through which the fiber bundles are exposed, and the adhesive part contacts the exposure area.